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IPC - Institute for Interconnecting and Packaging Electronic Circuits

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IPC Collections
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IPC 1066
Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Bottom of Form
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IPC 2221
Generic Standard on Printed Board Design Bottom of Form
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IPC 2222
Sectional Design Standard for Rigid Organic Printed Boards
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IPC 4101
Specification for Base Materials for Rigid and Multilayer Printed Boards
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IPC 6011
Generic Performance Specification for Printed Boards
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IPC 6012
Qualification and Performance Specification for Rigid Printed Boards
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IPC 6013
Qualification and Performance Specification for Flexible Printed Boards
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IPC 7351
Generic Requirements for Surface Mount Design and Land Pattern Standard
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IPC 7711
Rework of Electronic Assemblies; Repair and Modification of Printed Boards and Electronic Assemblies
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Includes IPC Guidelines, Test Method Manual, Assembly-Joining Handbook, Design Manual, and Trouble Shooting Guide for Printed Board Manufacture and Assembly Guidelines; and covers printed boards, design; flexible printed wiring-encapsulated, single-side; multilayer printed wiring boards; modification and repair; solderability; and terms and definitions.


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American Society of Safety Engineers (ASSE)
ASTM International (ASTM)
Alliance for Telecommunications Industry Solutions (ATIS)
American Welding Society (AWS)
British Standards Institution (BSI)
Consumer Electronics Association (CEA)
CSA International (CSA)
Canadian Standards Association/American National Standard (CSA/AM)
Deutsches Institut für Normung (DIN)
Electronic Components, Assemblies & Materials Association (ECA)
Electronic Industries Association (EIA)
General Motors (GM)
Government Electronics & Information Technology Association (GEIA)
International Electrotechnical Commission (IEC)
Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Institute for Interconnecting and Packaging Electronic Circuits (IPC)
Industrial Safety Equipment Association (ISEA)
International Organization for Standardization (ISO)
Japanese Standards Association (JSA)
National Electrical Manufacturers Association (NEMA)
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RTCA, Inc.
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Underwriters Laboratories Inc. (UL)
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More IPC documents
IPC 9701
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Bottom of Form
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IPC-CC-830B
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
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IPC/WHMA-A-620
Requirements and Acceptance for Cable and Wire Harness Assemblies
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J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
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J-STD-003
Solderability Tests for Printed Boards
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J-STD-004
Requirements for Soldering Fluxes Bottom of Form
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J-STD-005
Requirements for Soldering Pastes
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J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Bottom of Form
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July 22, 2008
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The Digital Video Broadcasting (DVB) Steering Board ratified and published the DVB-T2 specification, which is a second generation transmission ... more
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The GSM Association (GSMA) completed trials of voice calls based on the Session Initiation Protocol with encapsulated ISUP (SIP-I) between core ... more
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ITU Forms Group to Work on Standards Related to ICT Impact on Climate Change
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July 22, 2008
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Global markets for Bluetooth (IEEE 802.15) and Wi-Fi (IEEE 802.11) continue to show strong growth and will remain the leading personal area networking ... more
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