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| EIA-763 |
| Bare Die and Chip Scale Packages Taped in 8 rnrn & 12 rnrn Carrier Tape for Automatic Handling |
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EIA-763 - Bare Die and Chip Scale Packages Taped in 8 rnrn & 12 rnrn Carrier Tape for Automatic Handling
Scope
This standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. Refer to EIA 48 1-1 for current industry standard for 8 mm and 12 mm taping of surface mount components.
Introduction
This standard was formulated to provide orientations, dimensions and tolerances necessary to tape bare die and chip scale packages that require special carrier tape designs to protect devices from shipping damage as well as provide a more accurate and repeatable presentation to the automatic handling equipment.
Applicable documents
Unless otherwise specified, the following documents form a part of this Standard to the extent specified herein:
- EIA-481-1 “8mm & 12mm Punched & Embossed Carrier Taping of Surface Mount Components for Automatic Handling”.
- EIA-747 “Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components For Automatic Handling of Devices Generally Less than 1 .O mm thick.”
- EIA-3 83 “Preparation for the Delivery of Electrical and Electronic Components”.
- EIA-54 1 “Packaging Material Standards for ESD Sensitive Items”.
- EIA-556 “Electronic Industries Association Outer Shipping Container Bar Code Label Standard”.
- EIA-624 “Electronics Industries Association- Product Package Bar Code Label Standard for Non-Retail Applications”.
- EIA-583 “Packaging Material Standards for Moisture Sensitive Items.”
- ASME Y 14.5M- 1994 “Dimensioning and Tolerancing.”