IPC - Institute for Interconnecting and Packaging Electronic Circuits
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| IPC - 1066 |
| Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Bottom of Form |
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IPC - 1066 - 01/01/2005 - Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices Bottom of Form
SCOPE
This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.
This standard shall apply to all electronic components including passives, connectors, solid-state components and other devices that use solder to attach the device/component to the board or assembly.
This standard shall not apply to:
- Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
- Lead in electronic ceramic parts (e.g., piezoelectronic devices).
APPLICABLE DOCUMENTS
- IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
- IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
- IEC 61249-2-21 Materials for Interconnection