IPC - Institute for Interconnecting and Packaging Electronic Circuits
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| IPC - 2222 |
| Sectional Design Standard for Rigid Organic Printed Boards |
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IPC - 2222 - 02/01/1998 - Sectional Design Standard for Rigid Organic Printed Boards-Supersedes IPC-D-275 - September 1991
This standard establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.
Purpose
The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 (see 2.0) to produce detailed designs intended to mount and attach passive and active components,
The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to pedorm the physical, thermal, environmental, and electronic function.