IPC - Institute for Interconnecting and Packaging Electronic Circuits
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| IPC-9701 |
| Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Bottom of Form |
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IPC - 9701 - 01/01/2002 - Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Bottom of Form
SCOPE
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
Purpose
The purpose of this document is:
To provide confidence that the design and the manufacturing/assembly processes create a product that is capable of meeting its intended goals.
To permit the analytical prediction of reliability based on a generic database and technical understanding. To provide standardized test methods and reporting procedures.
Performance Classification
This specification recognizes that surface mount assemblies (SMAs) will be subject to variations in performance requirements based on end use. While Performance Classes are defined in IPC- 60 11, Generic Performance Specijication for Printed Boards, these performance classifications are not specific as to the required reliability. At this point in time, the reliability requirements need to be established by agreement between customer and supplier.