IPC - Institute for Interconnecting and Packaging Electronic Circuits
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| IPC - J-STD-003A |
| Solderability Tests for Printed Boards |
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IPC - J-STD-003A - 02/01/2003 - Solderability Tests for Printed Boards
Scope
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user.
Purpose
The solderability determination is made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. This is determined by evaluation of the solderability specimen portion of a board or representative coupon which has been processed as part of the panel of boards and subsequently removed for testing per the method selected.
Objective
The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes.