IPC - Institute for Interconnecting and Packaging Electronic Circuits
 |
| IPC J-STD-004A |
| Requirements for Soldering Fluxes Bottom of Form |
 Buy |
IPC Collections
Online subscriptions to multiple documents on various subjects |
Info |
| To speak with an IHS Subject Matter Expert call 1-888-752-0334, outside the US/Canada call 303-397-2892. |
|
|
IPC J-STD-004A - 01/01/2004 - Requirements for Soldering Fluxes Bottom of Form
Scope
This standard prescribes general requirements for the classification and testing of fluxes for high quality solder interconnections. This standard is a flux characterization, quality control, and procurement document for flux and flux-containing material.
Purpose
This standard defines the classification of soldering materials through specifications of test methods and inspection criteria. These materials include: liquid flux, paste flux, solder paste flux, solder preform flux, and flux cored solder. It is not the intent of this standard to exclude any acceptable flux or soldering aid material; however, these materials must produce the desired electrical and metallurgical interconnection.
The requirements for fluxes are defined in general terms for standardized classification. Appendix B has additional information that will help users understand some of the requirements of this standard. In practice, where more stringent requirements are necessary or other manufacturing processes are used, such as soldering with alloys other than tin/lead, the user shall define these as additional requirements.
There are unresolved issues related to fluxes that are evaluated and used with certain lead free alloys. While some criteria may be applicable to testing with lead free alloys, users need to recognize that other testing may be required. Future revisions to this standard will address those issues when sufficient data is available.