IPC - Institute for Interconnecting and Packaging Electronic Circuits

	IPC J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Bottom of Form Buy IPC Collections Online subscriptions to multiple documents on various subjects Info To speak with an IHS Subject Matter Expert call 1-888-752-0334, outside the US/Canada call 303-397-2892. More Top IPC Standards...

IPC J-STD-006A - 05/01/2001 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Bottom of Form

Scope
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for "special" electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.

This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry:

• IPCIEIA J-STD-004 Requirements for Soldering Fluxes
• IPCIEIA J-STD-005 Requirements for Soldering Pastes
• IPCIEIA J-STD-O06 Requirements for Electronic Grade Solder
• Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications