|
TIA 5230000 |
Generic Specification for Field Portable Optical Fiber Cleaving Equipment |
|
CEA CEA-DTVCC |
DTV Closed Captioning Test Materials-***Please Purchase from Global Engineering Documents (http://global.ihs.com/)*** |
|
TIA EIA/TIA-455-59 |
FOTP-59 Measurement of Fiber Point Defects Using an OTDR |
|
TIA EIA/TIA-458-B |
Standard Optical Fiber Material Classes and Preferred Sizes |
|
TIA EIA/TIA-539AA00 |
Blank Detail Specification for Field Portable Polishing Devices for Preparation of Optical Fibers |
|
JEDEC EIA-365 |
Performance Test Procedure for Solar Cells and Calibration Procedure for Solar Cell Standards for Space Vehicle Service |
|
JEDEC EIA-397 |
Recommended Standards for Thyristors |
|
TIA EIA-455-43 |
FOTP-43 Output Near-Field Radiation Pattern Measurement of Optical Waveguide Fibers-Replaced by TIA-455-176-A:2003 |
|
TIA EIA-538 |
Facsimile Coding Schemes and Coding Control Functions for Group 4 Facsimile Equipment |
|
TIA IS-85 |
Cellular System Recommended Minimum Performance Standards for Full-Rate Speech Codes-Errata - 1993 |
|
JEDEC JEP106U.01 |
Standard Manufacturer’s Identification Code |
|
JEDEC JEP116 |
CMOS Semicustom Design Guidelines |
|
JEDEC JEP118 |
Guidelines for GaAs MMIC and FET Life Testing |
|
JEDEC JEP138 |
User Guidelines for IR Thermal Imaging Determination of Die Temperature |
|
JEDEC JEP139 |
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding |
|
JEDEC JEP140 |
Beaded Thermocouple Temperature Measurement of Semiconductor Packages |
|
JEDEC JEP95 BOOK 1 SECTION 5 |
Section 5 Standard Outlines-Revisions: 04/28/2000 to 07/14/2004 ***INDEX ONLY*** |
|
JEDEC JEP95 BOOK 2 SECTION 9 |
UO Outlines-Revisions: 04/28/2000 to 07/14/2004 ***INDEX ONLY*** |
|
JEDEC JES2 |
Transistor, Gallium Arsenide Power Fet, Generic Specification |
|
JEDEC JESD10 |
Low Frequency Power Transistors |
|
JEDEC JESD100B.01 |
Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits |
|
JEDEC JESD12 |
Standard for Gate Array Benchmark Set |
|
JEDEC JESD12-3 |
CMOS Gate Array Macrocell Standard |
|
JEDEC JESD13-B |
Description of |
|
JEDEC JESD2 |
Digital Bipolar Pinouts for Chip Carriers |
|
JEDEC JESD204 |
Serial Interface for Data Converters |
|
JEDEC JESD24-3 |
Thermal Impedance Measurements for Vertical Power MOSFETs (Delta Source-Drain Voltage Method)-Addendum to JEDEC JESD 24 |
|
JEDEC JESD28-A |
Procedure for Measuring N-Channel MOSFET Hot-Carrier-Induced Degradation under DC Stress |
|
JEDEC JESD307 |
Voltage Regulator Diode Noise Voltage Measurement |
|
JEDEC JESD35-2 |
Test Criteria for the Wafer-Level Testing of Thin Dielectrics |
|
JEDEC JESD37 |
Standard for Lognormal Analysis of Uncensored Data, and of Singly Right-Censored Data Utilizing the Persson and Rootzen Method |
|
JEDEC JESD48B |
Product Discontinuance |
|
JEDEC JESD49A |
Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD) |
|
JEDEC JESD5 |
Mesurement of Temperature Coefficient of Voltage Regulator Diodes |
|
JEDEC JESD6 |
Measurement of Small Values of Transistor Capacitance |
|
JEDEC JESD67 |
I/O Drivers and Receivers with Configurable Communication Voltage, Impedance, and Receiver Threshold-Errata Sheet - June 1999 |
|
JEDEC JESD71 |
Standard Test and Programming Language (STAPL) |
|
JEDEC JESD72 |
Test Methods and Acceptance Procedures for the Evaluation of Polymeric Materials |
|
JEDEC JESD73-3 |
Standard for Description of 3867: 2.5 V, 10-Bit, 2-Port, DDR FET Switch |
|
JEDEC JESD75-1 |
Ball Grid Array Pinouts Standardized for 16, 18 and 20-Bit Logic Functions Using a 54 Ball Package |
|
JEDEC JESD75-3 |
Ball Grid Array Pinouts Standardized for 8-Bit Logic Functions |
|
JEDEC JESD75-4 |
Ball Grid Array Pinout for 1-, 2-, and 3-Bit Logic Functions |
|
JEDEC JESD76-1 |
Standard Description of 1.2 V CMOS Logic Devices (Wide Range Operations) |
|
JEDEC JESD76-2 |
Standard Description of 1.2 V CMOS Logic Devices (Normal Range Operations) |
|
JEDEC JESD77B.01 |
Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices-Minor Revision of JESD77-B |
|
JEDEC JESD8-16A |
Bus Interconnect Logic (BIC) for 1.2 Volts |
|
JEDEC JESD82-10A |
Definition of the SSTU32866 1.8 V Configurable Registered Buffer with Parity Test for DDR2 RDIMM Applications |
|
JEDEC JESD82-11 |
Standard for Definition of CU878 PLL Clock Driver for Registered DDR2 DIMM Applications |
|
JEDEC JESD82-14A |
Definition of the SSTUB32868 1.8 V Configurable Registered Buffer with Parity for DDR2 RDIMM Applications |
|
JEDEC JESD82-16A |
Definition of the SSTUA32866 1.8 V Configurable Registered Buffer with Parity Test for DDR2 RDIMM Applications |
|
JEDEC JESD82-18A |
Standard for Definition of CUA877 and CU2A877 PLL Clock Drivers for for Registered DDR2 DIMM Applications |
|
JEDEC JESD82-20 |
FBDIMM: Advanced Memory Buffer (AMB) |
|
JEDEC JESD82-22 |
Instrumentation Chip Data Sheet for FBDIMM Diagnostic Senselines |
|
JEDEC JESD82-26 |
Definition of the SSTUB32868 Registered Buffer with Parity for 2R x 4 DDR2 RDIMM Applications |
|
JEDEC JESD82-6A |
Definition of the SSTV32852 2.5-V 24-Bit to 48-Bit SSTL_2 Registered Buffer for 1U Stacked DDR DIMM Applications |
|
JEDEC JESD91A |
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms |
|
JEDEC JESD92 |
Procedure for Characterizing Time- Dependent Dielectric Breakdown of Ultra-Thin Gate Dielectrics |
|
TIA J-STD-007 |
Telecommunications - Personal Communications Services - PCS1900 - Air Interface Specification-ATIS |
|
TIA J-STD-014 |
Telecommunications - Personal Access Communications System Air Interface Standard-ATIS; Revision and Consolidation of ANSI J-STD-014-1996 and ANSI J-STD-014C-1997 |
|
TIA J-STD-019 |
Telecommunications - Recommended Minimum Performance Requirements for Base Stations Supporting 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Stations-ATIS; From Standards Proposal No. 3383 |
|
TIA J-STD-021 |
Telecommunications - Recommended Minimum Performance Standards of Personal Access Communications System (PACS) Subscriber Units-ATIS |
|
TIA PN 3-0156 |
Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Repeaters-To be published as TIA-1037 |
|
TIA PN 3-0272.003-A |
Radio Link Layer for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.003 |
|
TIA PN 3-0272.008-A |
Route Control Plane for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.008 |
|
TIA PN 3-0280 |
Test source launch condition guidelines for testing installed multimode cabling-To be published as TIA TSB-178 |
|
TIA PN 3-4545.1-RV5 |
Interoperability Specification (IOS) for cdma2000® Access Network Interfaces – Part 1 Overview-To be published as TIA-2001.1-E |
|
TIA PN 3-4545.3-RV5 |
Interoperability Specification (IOS) for cdma2000 Access Network Interfaces – Part 3 Features-To be published as TIA-2001.3-E |
|
TIA PN 3-4545.6-RV5 |
Interoperability Specification (IOS) for cdma2000 Access Network Interfaces – Part 6 (A8 and A9 Interfaces)-To be published as TIA-2001.6-E |
|
TIA PN 3-4935.010-RV2 |
IP Multimedia Subsystem Sh interface; Signaling flows and message contents – Stage 2-To be published as TIA-873.010-B |
|
TIA SP 3-0006-RV2 |
Detail specification for 62.5-µm core diameter/125-µm cladding diameter class Ia graded-index multimode optical fibers-To be published as TIA-492AAAA-B |
|
TIA SP 3-3582-WD |
FOTP-50 Light Launch Conditions for Long-Length Graded-Index Optical Fiber Spectral Attenuation-Comment Period Expires: July 28, 2003; TIA/EIA-455-50-B; Now a Published Standard - See TIA-455-50B |
|
ECA SP 4945-A |
Contact Retention Test Procedure for Electrical Connectors-To be published as ANSI/EIA/ECA-364-29C |
|
ECA SP 5114 |
Electrical Relay Socket Specifications-Proposed Reaffirmation for ANSI/EIA-540COOOO, 540CAOOOO, 540CAAA, and 540CAAB |
|
ECA SP 5126 |
Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets-To be published as ANSI/EIA/ECA-364-86 |
|
ECA SP 5142 |
Test Procedures for Electrical Connectors and Sockets-To be published as ANSI/EIA-364-01, 21, 22, 39, 43, 45, 53, 66, 83, 90, 101, 105, 107, and 108 |
|
ECA SP 5143 |
Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Controlled Environment Applications-To be published as ABSI/EIA/ECA-364-1000 |
|
ECA SP 5160 |
Withstanding Voltage Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts-To be published as ANSI/EIA/ECA-364-20D |
|
ECA SP2800-A |
Sectional Specification for Fixed Metallized Electrode Film Dielectric AC Capacitors-Comment Period Expires: November 12, 1997; EIA-580B000 |
|
ECA SP3275-A |
Detail Specification for 8-Byte, 168 Position Dual In-Line Memory Module (DIMM) Sockets, 1.27 mm Pitch, Vertical Mount-Comment Period Expires: July 8, 1997; EIA-540FAAF |
|
ECA SP3703 |
Detail Specification for High Density Tuning Fork Contacts and Components of Certified Quality-Comment Period Expires: September 20, 1999; EIA-700D0AA |
|
ECA SP4973 |
Proposed New Specification Detail Specification for Production Ball Grid Array (BGA), Low Pin Count (1088 Pins and Less) Socket for Use in Electronic Equipment-Comment Period Expires: April 11, 2002; Proposed Document Number EIA-540BOAB |
|
TIA TIA/EIA/IS-686 |
TDMA Cellular/PCS - Radio Interface - Minimum Performance Standards for IS-641 Full-Rate Voice Coder |
|
TIA TIA/EIA/IS-728 |
Intersystem Link Protocol-Replaced by TIA-728 |
|
TIA TIA/EIA/IS-764 |
TIA/EIA-41-D Enhancements for Wireless Calling Name Feature Descriptions |
|
TIA TIA/EIA/IS-787 |
Common ATM Satellite Interface Interoperability Specification (CASI) |
|
TIA TIA/EIA/IS-823 |
TTY/TDD Extension to TIA/EIA 136-410 Enhanced Full Rate Speech Codec-Replaced by TIA/EIA/IS-823-A |
|
TIA TIA/EIA-136-132 |
TDMA Cellular PCS; Digital Traffic Channel Layer 2-No Replacement |
|
TIA TIA/EIA-455-161 |
FOTP161 Procedure for Assessing Temperature Exposure and Humidity Exposure Effects on Mechanical Characteristics of Optical Fibers-WITHDRAWN SEPTEMBER 2003 - REPLACED BY TIA-455-160 |
|
TIA TIA/EIA-455-93 |
FOTP-93 Test Method for Optical Fiber Cladding Diameter and Noncircularity by Noncontacting Michelson Interferometry |
|
TIA TIA/EIA-573CA00 |
Blank Detail Specification for Field-Portable Optical Microscopes |
|
TIA TIA/EIA-635 |
800 MHz Cellular System, TDMA Radio Interface, Recommended Minimum Performance Standards for Full-Rate Speech Codec |
|
TIA TIA/IS-102. BAAA |
APCO Project 25 Recommended Common Air Interface New Technology Standards Project Digital Radio Technical Standards |
|
TIA TIA-1010 |
IP-Based Over-the-Air Handset Configuration Management (IOTA-HCM)-No Replacement |
|
TIA TIA-455-133 |
FOTP-133 Length Measurement of an Optical Fiber or Cable by the Phase-Shift Method-Withdrawn May 2003; Superceded by TIA-455-133-A |
|
TIA TIA-455-60-A |
FOTP-60 Measurement of Fiber of Cable Length Using and OTDR-Withdrawn May 2003; Replaced by TIA-455-133-A |
|
TIA TR-107 |
FM Broadcast Transmitters (88-108 Mc), Electrical Performance Standards for |
|
TIA TSB102.AACC |
Conformance Tests for the Project 25 Over-The-Air Rekeying (OTAR) Protocol New Technology Standards Project Digital Radio Technical Standards-Replaced by TIA/EIA-102.AACC |
|
TIA TSB26 |
Alternate Connector for Use with ANSI/EIA-232-D and ANSI/EIA-530-Replaced by EIA/TIA-232 and TIA/EIA-530 |
|
TIA TSB48 |
Method of Measurement for Land Mobile Receiver Impulse Blanking Effectiveness |
|
TIA TSB51 |
Cellular Radiotelecommunications Intersystem Operations: Authentication, Signaling Message Encryption and Voice Privacy-Replaced by TIA/EIA-41-D |
|
TIA TSB55 |
IS-41-A Forward Compatibility Rules-Replaced by TIA/EIA-41 Rev D |
|
TIA TSB62-2 |
ITM-2 Method of Measurement of Hydrogen Evolved from Coated Optical Fiber |
|
TIA TSB-68 |
PCN to PCN Intersystem Operations - IS-41 Based-Withdrawn October 2003 |
|
TIA TSB73 |
IS-136/IS-136-A Compatibility Issues |
|
TIA TSB84-A |
Licensed PCS to PCS Interference-No Replacement |
|
TIA 258 |
Semi-Flexible Air Dielectric Coaxial Cables and Connectors, 50 Ohms |
|
TIA 368 |
Frequency Division Multiplex Equipment Standard for Nominal 4 kHz Channel Bandwidths (Non-Compandored) and Wideband Channels (Greater Than 4 kHz) |
|
TIA 410 |
Electrical Characteristics of Class A Closure Interchange Circuits |
|
TIA 455-27A |
Fibers, Measuring Outside (Uncoated) Diameter of Optical Waveguide-*NOT CURRENT DOCUMENT |
|
TIA 5460000 |
Generic Specification for a Field Portable Optical Inspection Device |
|
CEA CEA-2003-C |
Digital Audiobook File Format and Player Requirements |
|
CEA CEA-851.2 |
Security Services for the Versatile Home Network-Replaced by CEA-851-A |
|
TIA EIA/TIA-472CA00 |
Blank Detail Specification for Fiber Optic Communications Cable for Indoor Use - All-Dielectric (Construction 1)-Partial Revision of EIA-472CXX0 |
|
TIA EIA/TIA-475CC00 |
Blank Detail Specification Connector Set for Optical Fibers and Cables Type FSMA: Environmental Category III |
|
TIA EIA/TIA-539A000 |
Sectional Specification for Field Portable Polishing Devices for Preparation of Optical Fibers |
|
TIA EIA/TIA-547 |
Network Channel Terminal Equipment for DS1 Service |
|
JEDEC EIA-311-A |
Transistor Noise Figure and Effective Input Noise Temperature at MF, HF and VHF, Measurement of |
|
JEDEC EIA-371 |
Measurement of Small-Signal VHF-UHF Transistor Short-Circuit Forward Current Transfer Ratio |
|
TIA EIA-492BA00 |
Blank Detail Specification for Class IVa Dispersion-Unshifted Single-Mode Optical Waveguide Fibers |
|
TIA IS-54-B |
Cellular System Dual-Mode Mobile Station - Base Station Compatibility Standard-Replaced by TIA/EIA-627 |
|
TIA IS-759 |
Multilayer Chip Inductor Qualification Specification |
|
JEDEC JEB19 |
Recommended Characterization of MOS Shift Registers |
|
JEDEC JEB5-A |
Methods of Measurement for Semiconductor Logic Gating Microcircuits |
|
JEDEC JEP132 |
Process Characterization Guideline |
|
JEDEC JEP136 |
Signature Analysis |
|
JEDEC JEP84A |
Recommend Practice for Measurement of Transistor Lead Temperature |
|
JEDEC JEP95 BOOK 2 SECTION 6 |
List of Registered Microelectronic Carrier (CO) Outlines-Revisions: 04/28/2000 to 07/14/2004 ***INDEX ONLY*** |
|
JEDEC JESD1 |
Leadless Chip Carrier Pinouts Standardized for Linear's |
|
JEDEC JESD12-2 |
Standard for Cell-Based Integrated Circuit Benchmark Set |
|
JEDEC JESD24-1 |
Method for Measurement of Power Device Turn-Off Switching Loss-Addendum to JEDEC JESD 24 |
|
JEDEC JESD24-10 |
Test Method for Measurement of Reverse Recovery Time trr for Power MOSFET Drain-Source Diodes-Addendum to JEDEC JESD 24 |
|
JEDEC JESD24-11 |
Power MOSFET Equivalent Series Gate Resistance Test Method-Addendum to JEDEC JESD 24 |
|
JEDEC JESD24-4 |
Thermal Impedance Measurements for Bipolar Transistors (Delta Base- Emitter Voltage Method)-Addendum to JEDEC JESD 24 |
|
JEDEC JESD24-5 |
Single Pulse Unclamped Inductive Switching (UIS) Avalanche Test Method-Addendum to JEDEC JESD 24 |
|
JEDEC JESD24-7 |
Commutating Diode Safe Operating Area Test Procedure for Measuring DV/DT During Reverse Recovery of Power Transistors-Addendum to JEDEC JESD 24 |
|
JEDEC JESD313B |
Conduction Cooled Power Transistors, Thermal Resistance Measurements of-Revision of EIA-313-B formerly RS-313-B |
|
JEDEC JESD35-1 |
General Guidelines for Designing Test Structures for the Wafer-Level Testing of Thin Dielectrics |
|
JEDEC JESD381A |
Method of Diode “Q†Measurement-Reaffirmation of ANSI/EIA-381-1-1992 |
|
JEDEC JESD390A |
Standard Test Procedure for Noise Margin Measurements for Semiconductor Logic Gating Microcircuits |
|
JEDEC JESD419A |
Standard List of Values to be Used in Semiconductor Device Specifications and Registration Formats-Revision of EIA RS-419-A formerly RS-419) |
|
JEDEC JESD62-A |
Outlier Identification and Management System for Electronic Components |
|
JEDEC JESD68.01 |
Common Flash Interface (CFI) |
|
JEDEC JESD70 |
2.5 V BiCMOS Logic Device Family Specification with 5 V Tolerant Inputs and Outputs |
|
JEDEC JESD73-2 |
Standard for Description of 3.3 V NFET Bus Switch Devices with Integrated Charge Pumps |
|
JEDEC JESD75 |
Ball Grid Array Pinouts Standardized for 32-Bit Logic Functions |
|
JEDEC JESD75-5 |
SON/QFN Package Pinouts Standardized for 1-, 2-, and 3-Bit Logic Functions |
|
JEDEC JESD76 |
Description of 1.8 V CMOS Logic Devices |
|
JEDEC JESD8-17 |
Driver Specifications for 1.8 V Power Supply Point-to-Point Drivers |
|
JEDEC JESD82-13A |
Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700 and PC3200 DDR DIMM Applications |
|
JEDEC JESD82-15 |
Standard for Definition of CUA878 PLL Clock Driver for Registered DDR2 DIMM Applications |
|
JEDEC JESD82-19A |
Definition of the SSTUA32S865 DDR2 RDIMM Applications Registered Buffer with Parity for and SSTUA32D865 28-bit 1:2 |
|
JEDEC JESD82-2 |
Desription of a 3.3 V, 18-Bit, LVTTL I/O Register for PC133 Registered DIMM Applications |
|
JEDEC JESD82-27 |
Definition of the SSTUB32869 Registered Applications Buffer with Parity for DDR2 RDIMM |
|
JEDEC JESD82-9B |
Definition of the SSTU32865 Registered Buffer with Parity for 2R × 4 DDR2 RDIMM Applications |
|
JEDEC JESD8-3A |
Gunning Transceiver Logic (GTL) Low-Level, High Speed Interface Standard for Digital Integrated Circuits |
|
JEDEC JESD8-7A |
1.8 V (PLUS OR MINUS) 0.15 V (Normal Range), and 1.2 - 1.95 V (Wide Range) Power Supply Voltage and Interface Standard for Non-Terminated Digital Integrated Circuit |
|
TIA J-STD-011 |
Telecommunications - PCS IS-136 Based Air Interface Compatibility 1900 MHz Standard-ATIS |
|
TIA J-STD-018 |
Telecommunications - Recommended Minimum Performance Requirements for 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Stations-ATIS |
|
TIA PN 3-0237 |
Security Mechanisms using GBA-To be published as TIA-1097 |
|
TIA PN 3-0262 |
MIPv4 Enhancements-To be published as TIA-1116 |
|
TIA PN 3-0272.000-A |
Overview for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.000 |
|
TIA PN 3-0272.002-A |
MAC Layer for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.002 |
|
TIA PN 3-0272.005-A |
Security Functions for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.005 |
|
TIA PN 3-0272.007-A |
Session Control Plane for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.007 |
|
TIA PN 3-0272.009-A |
Broadcast-Multicast Upper Layers for Ultra Mobile Broadband (UMBTM) Air Interface Specification-To be published as TIA-1121.009 |
|
TIA PN 3-3648-RV2.SF1 |
Software Distribution for Enhanced Variable Rate Codec (EVRC), Speech Service Options 3 and 68, Minimum Performance Specification (MPS)-To be published as TIA-718-B [SF] |
|
TIA PN 3-4545.7-RV5 |
Interoperability Specification (IOS) for cdma2000® Access Network Interfaces – Part 7 (A10 and A11 Interfaces)-To be published as TIA-2001.7-E |
|
TIA PN 3-4822-AD1-S |
Telecommunications Infrastructure Standard for Industrial Premises; Addendum 1 – Industrial Pathways and Spaces-To be published as TIA-1005-1 |
|
TIA PN 3-4935.011-RV2 |
Sh Interface Based on Diameter Protocol; Protocol Details – Stage 3-To be published as TIA-873.011-B |
|
TIA SP 3-0142 |
IEC 61282-6 – Fibre Optic Communication System Design Guides – Part 6: Skew Design in Parallel Optical Interconnection-To be published as TIA/TR-1027 |
|
TIA SP 3-0186 |
UICC - Terminal Interface: Physical and Logical Characteristics for cdma2000 Spread Spectrum Systems-To be published as TIA-1058 |
|
TIA SP 3-2835-WD |
FOTP-59 Measurement of Fiber Point Defects Using an OTDR-Comment Period Expires: July 28, 2003; TIA/EIA-455-59-A; Now a Published Standard - See TIA-455-59A |
|
ECA SP 4942-B |
General Methods for Porosity Testing of Contact Finishes for Electrical Connectors and Sockets-To be published as ANSI/EIA/ECA-364-60A |
|
ECA SP 4971 |
Detail Specification for 1.27 mm Pitch, 68 Circuit Memory Card Interconnect System-To be published as ANSI/EIA-700AOAB |
|
ECA SP 5089-A |
Current Cycling Test Procedure for Electrical Connectors-To be published as ANSI/EIA/ECA-364-55A |
|
ECA SP 5103 |
Fluid Immersion Test Procedure for Electrical Connectors-To be published as ANSI/EIA/ECA-364-10D |
|
TIA SP1742-RF1 |
Electrical Performance for Television Transmission Systems-Comment Period Expires: September 7, 2000; TIA/EIA-250-C |
|
TIA SP2087 |
Procedure for Audiographic Teleconferencing Transmission-Comment Period Expires: July 2, 1990; EIA/TIA-586 |
|
TIA SP2278-A |
Procedure for Calculating Optoelectronic Device Reliability-Comment Period Expires: August 3, 1998; TIA/EIA-610 |
|
TIA SP2721-B |
Static Fatigue Parameters of Optical Fibers by Two-Point Bending-Comment Period Expires: May 4, 1994; TIA/EIA-455-97 |
|
TIA SP3385-WD |
Recommended Minimum Performance Requirements for 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Stations-Comment Period Expires: January 29, 2001 |
|
ECA SP3444 |
Detail Specification for Blind-Mate, Scoop Proof, EVA and Robotically Compatible, Subminiature Rectangular, Low Force, Latching Electrical Connector for Spacecraft Use in Habitable Pressurized Modules and Low Earth Orbit (LEO)-Comment Period Expires: September 20, 1999; EIA-700BAAC |
|
ECA SP3801-A-1 |
Plated Through Hole Integrity Test Procedure for Electrical Connectors-Comment Period Expires: April 6, 2002; ANSI/EIA-364-96,TP-96 |
|
TIA TIA/41.1-D |
Cellular Radiotelecommunications Intersystem Operations-Replaced by TIA/EIA-41-D |
|
TIA TIA/EIA/IS-129 |
Interworking/Interoperability between DCS 1900 and IS-41 Based MAPs for 1800 MHz Personal Communications Systems - Phase I |
|
TIA TIA/EIA/IS-135 |
800 MHz Cellular Systems TDMA Services Async Data and Fax |
|
TIA TIA/EIA/IS-651-A |
SS7 Based A-Interface |
|
TIA TIA/EIA/IS-653 |
ISDN Based A-Interface (Radio System - PCSC) for 1800 MHz Personal Communications Systems |
|
TIA TIA/EIA/IS-842 |
GSM Hosted SMS Teleservice (GHOST) |
|
TIA TIA/EIA/IS-847 |
Roamer Database Verification-Replaced by TIA/EIA/IS-847-A |
|
TIA TIA/EIA-136 SET |
TDMA THIRD GENERATION WIRELESS-Rev.E; Includes TIA-136 TEST VECTORS CD and all updates to 08/2006 |
|
TIA TIA/EIA-455-119 |
FOTP-119 Coating Geometry Measurement for Optical Fiber by Gray-Scale Analysis |
|
TIA TIA/EIA-465-A |
Group 3 Facsimile Apparatus for Document Transmission |
|
TIA TIA/EIA-472DAAA |
Detail Specification for All-Dielectric Fiber Optic Communications Cable for Outside Plant Use, Containing Class Ia, 62.5 Micro Meters Core Diameter/125 Micro Meters Cladding Diameter/250 Micro Meters Coating Diameter Optical Fiber(s) |
|
TIA TIA/EIA-614 |
Binary File Transfer Format for Group 3 Facsimile |
|
TIA TIA-455-120 |
FOTP120 Modeling Spectral Attenuation on Optical Fiber-WITHDRAWN SEPTEMBER 2003; REPLACED BY TIA-455-78-B |
|
TIA TIA-514 |
Telephone Exclusion-Key Interface |
|
TIA TIA-5730000-A |
Generic Specification for Field-Portable Fiber-Optic Tools |
|
TIA TIA-573D000 |
Sectional Specification for Field-Portable Polishing Devices for Preparation of Optical Fibers |
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TIA TSB NO 16 |
Assignment of Access Overload Classes in the Cellular Telecommunications Services-Replaced by TIA/EIA-TSB-16-A |
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TIA TSB NO 21 |
Uniform Cellular Feature Code and Service Code Dialing Plan-Formerly Project No. 2583 |
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TIA TSB102.BAEB |
APCO Project 25 Packet Data Specification New Technology Standards Project Digital Radio Technical Standards |
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TIA TSB122-A |
Telecommunications IP Telephony Equipment Voice Gateway Loss and Level Plan Guidelines-Revision of TSB122 |
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TIA TSB62-8 |
ITM-8 Procedures for Measuring the Amount of Extractable Material in Coatings Applied to Optical Fibers |
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TIA TSB65 |
IS-41-B Mobile Border System Problems |