|
IEC 60746-3 CORR 1 |
Expression of performance of electrochemical analyzers – Part 3: Electrolytic conductivity CORRIGENDUM 1-Second Edition |
|
IEC 60746-4 |
Expression of performance of electrochemical analyzers - Part 4: Dissolved oxygen in water measured by membrane covered amperometric sensors-First Edition |
|
IEC 60747-14-1 |
Semiconductor Devices - Part 14-1: Semiconductor Sensors - General and Classification-First Edition |
|
IEC 60747-14-2 |
Semiconductor Devices - Part 14-2: Semiconductor Sensors - Hall Elements-First Edition |
|
IEC 60747-14-3 |
Semiconductor Devices - Part 14-3: Semiconductor Sensors - Pressure Sensors-First Edition |
|
IEC 60747-2-2 |
Semiconductor devices - Discrete devices - Part 2: Rectifier diodes - Section 2: Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100 A-First Edition; |
|
IEC 60747-3 |
Semiconductor devices - Discrete devices - Part 3: Signal (including switching) and regulator diodes-Edition 1.0; Amendment 1: 10/1991; Amendment 2: 11/1993 |
|
IEC 60747-6-2 |
Semiconductor Devices Discrete Devices Part 6: Thyristors Section Two - Blank Detail Specification for Bidirectional Triode Thyristors (Triacs), Ambient or Case-Rated, up to 100 A-First Edition |
|
IEC 60747-7-1 |
Semiconductor Devices - Discrete Devices Part 7: Bipolar Transistors Section One - Blank Detail Specification for Ambient-Rated Bipolar Transistors for Low and High-Frequency Amplification-First Edition |
|
IEC 60747-7-2 |
Semiconductor Devices - Discrete Devices Part 7: Bipolar Transistors Section Two - Blank Detail Specification for Case-Rated Bipolar Transistors for Low-Frequency Amplification-First Edition |
|
IEC 60748-2-12 |
Semiconductor Devices - Integrated Circuits - Part 2-12: Digital Integrated Circuits - Blank Detail Specification for Programmable Logic Devices (PLDs)-First Edition; IECQ QC 790121 |
|
IEC 60748-23-4 |
Semiconductor Devices - Integrated Circuits - Part 23-4: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Blank Detail Specification-First Edition |
|
IEC 60749-18 |
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)-First Edition |
|
IEC 60749-23 |
Semiconductor devices Mechanical and climatic test methods Part 23: High temperature operating life-First Edition; Replaces IEC PAS 62189:2000 |
|
IEC 60749-32 CORR 1 |
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1-First Edition |
|
IEC 60749-4 CORR 1 |
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1-First Edition |
|
IEC 60749-5 |
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test-First Edition; Replaces IEC/PAS 62161 |
|
IEC 60749-6 CORR 1 |
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 6: Storage at high temperature CORRIGENDUM 1-First Edition |
|
IEC 60749-8 CORR 2 |
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 8: Sealing CORRIGENDUM 2-First Edition |
|
IEC 60749-9 CORR 1 |
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 9: Permanence of Marking CORRIGENDUM 1-First Edition |
|
IEC 60822 |
IEC 822 VSB Parallel Sub-System Bus of the IEC 821 VMEbus-First Edition |
|
IEC 60823 |
Microprocessor System Bus (VMSbus) - Serial Sub-System Bus of the IEC 821 Bus (VMEbus)-First Edition |
|
IEC 61007 |
Transformers and Inductors for Use in Electronic and Telecommunication Equipment - Measuring Methods and Test Procedures-Second Edition |
|
IEC 61056-2 |
General purpose lead-acid batteries (valve-regulated types) Part 2: Dimensions, terminals and marking-Second Edition |
|
IEC 61188-5-2 |
Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components-First Edition; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987 |
|
IEC 61191-2 |
Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies-First Edition |
|
IEC 61248-2 |
Transformers and inductors for use in electronic and telecommunication equipment - Part 2: Sectional specification for signal transformers on the basis of the capability approval procedure-First Edition; IECQ QC 260100 |
|
IEC 61248-6 |
Transformers and Inductors for Use in Electronic and Telecommunication Equipment - Part 6: Sectional Specification for Inductors on the Basis of the Capability Approval Procedure-First Edition; IECQ QC 260500 |
|
IEC 61587-2 |
Mechanical Structures for Electronic Equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic Tests for Cabinets and Racks-First Edition |
|
IEC 61843 |
Measuring Method for the Level of Intermodulation Products Generated in a Gyromagnetic Device-First Edition |
|
IEC 61967-4 |
Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 4: Measurement of Conducted Emissions - 1 OHMS/150 OHMS Direct Coupling Method-Edition 1.1; Consolidated Reprint |
|
IEC 61969-2-2 |
Mechanical Structures for Electronic Equipment - Outdoor Enclosures - Part 2-2: Detail Specification - Dimensions for Cases-First Edition |
|
IEC 61969-3 |
Mechanical Structures for Electronic Equipment - Outdoor Enclosures - Part 3: Sectional Specification - Climatic, Mechanical Tests and Safety Aspects for Cabinets and Cases-First Edition |
|
IEC 61982-2 |
Secondary Batteries for the Propulsion of Electric Road Vehicles - Part 2: Dynamic Discharge Performance Test and Dynamic Endurance Test-First Edition |
|
IEC 61982-3 |
Secondary Batteries for the Propulsion of Electric Road Vehicles - Part 3: Performance and Life Testing (Traffic Compatible, Urban Use Vehicles-First Edition |
|
IEC 62016 |
Core model of the electronics domain-First Edition |
|
IEC 62211 |
Inductive components Reliability management-First Edition |
|
IEC TR 60444-4 |
Measurement of Quartz Crystal Unit Parameters by Zero Phase Technique in a PI-Network Part 4: Method for the Measurement of the Load Resonance Frequency FL, Load Resonance Resistance RL and the Calculation of Other Derived Values of Quartz Crystal Units, up to 30 MHz-First Edition |
|
IEC 60122-2-1 |
Quartz Crystal Units for Frequency Control and Selection Part 2: Guide to the Use of Quartz Crystal Units for Frequency Control and Selection - Section One: Quartz Crystal Units for Microprocessor Clock Supply-First Edition; Amendment 1 - 1993 |
|
IEC 60151-9 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 9: Methods of Measuring the Cathode-Interface Impedance-First Edition |
|
IEC 60329 |
Strip-Wound Cut Cores of Grain Oriented Silicon-Iron Alloy, Used for Electronic and Telecommunication Equipment-2.0 |
|
IEC 60444-8 |
Measurement of quartz crystal unit parameters Part 8: Test fixture for surface mounted quartz crystal units-First Edition; Cancels and Replaces IEC PAS 62277; |
|
IEC 60512-11-10 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-10: Climatic Tests - Test 11j: Cold-First Edition; This Standard Along with IEC 60512-11-5, 60512-11-6, 60512-11-9, 60512-11-12 and 60512-11-13 Replaces IEC 60512-6 |
|
IEC 60512-11-12 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-12: Climatic Tests - Test 11m: Damp Heat, Cyclic-First Edition; This Standard Along with IEC 60512-11-5, 60512-11-6, 60512-11-9, 60512-11-10 and 60512-11-13 Replaces IEC 60512-6 |
|
IEC 60512-11-4 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-4: Climatic Tests - Test 11d: Rapid Change of Temperature-First Edition |
|
IEC 60512-11-5 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-5: Climatic Tests - Test 11e: Mould Growth-First Edition; This Standard Along with IEC 60512-11-6, 60512-11-9, 60512-11-10, 60512-11-12 and 60512-11-13 Replaces IEC 60512-6 |
|
IEC 60512-11-8 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 8: Test 11h - Sand and dust-First Edition |
|
IEC 60512-1-4 |
Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 1: General - Section 4: Test 1d - Contact Protection Effectiveness (Scoop-Proof)-Corrigendum: 11 2000 |
|
IEC 60512-14-7 |
Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 14: Sealing Tests - Section 7: Test 14g: Impacting Water-First Edition |
|
IEC 60512-25-4 |
Connectors for Electronic Equipment - Test and Measurements - Part 25-4: Test 25d - Propagation Delay-First Edition |
|
IEC 60512-25-5 |
Connectors for electronic equipment Tests and measurements Part 25-5: Test 25e Return loss-First Edition |
|
IEC 60512-25-7 |
Connectors for electronic equipment Tests and measurements Part 25-7: Test 25g Impedance, reflection coefficient, and voltage standing wave ratio (VSWR)-First Edition |
|
IEC 60603-3 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 3: Two-Part Connectors for Printed Boards Having Contacts Spaced at 2.54 mm (0.100 in) Centres and Staggered Terminations at That Same Spacing-First Edition |
|
IEC 60603-5 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 5: Edge-Socket Connectors and Two-Part Connectors for Double-Sided Printed Boards with 2.54 mm (0.1 in) Spacing-First Edition |
|
IEC 60748-2 |
Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits-Second Edition |
|
IEC 60748-21 |
Semiconductor Devices - Integrated Circuits - Part 21: Sectional Specification for Film Integrated Circuits and Hybrid Film Intergrated Circuits on the Basis of Qualification Approval Procedures-Second Edition; IECQ QC 760100 |
|
IEC 60748-23-1 |
Semiconductor Devices - Integrated Circuits - Part 23-1: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Generic Specification-First Edition |
|
IEC 60748-23-5 |
Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval-First Edition; QC 165000-5 |
|
IEC 60748-2-5 |
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Five - Blank Detail Specification for Complementary MOS Digital Integrated Circuits (Series 4 000 B and 4 000 UB)-Edition 1; IECQ QC 790131 |
|
IEC 60748-4 |
Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits-Second Edition; IECQ QC 790300 |
|
IEC 60749-19 |
Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength-First Edition |
|
IEC 60807-8 |
Rectangular connectors for frequencies below 3 MHz - Part 8: Detail specification for connectors, four-signal contacts and earthing contacts for cable screen-First Edition |
|
IEC 61020-6 |
Electromechanical Switches for Use in Electronic Equipment Part 6: Sectional Specification for Sensitive Switches-First Edition; Together with 61020-6-1: 1991, it Replaces 60163-1: 1984; IECQ QC 960300 |
|
IEC 61076-3-104 |
Connectors for electronic equipment – Product requirements – Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 1 000 MHz-Edition 2.0 |
|
IEC 61076-4-108 |
Connectors for Electronic Equipment - Part 4-108: Printed Board Connectors with Assessed Quality - Detail Specification for Cable-to-Board Connectors with a Modular Pitch of 25 mm and Integrated Shielding Function, Applicable for Transverse Packing Density of 15 mm, Having a Basic Grid of 2,5 mm in Accordance with IEC 60917-1-First Edition; QC 480301XX0009 |
|
IEC 61188-1-1 |
Printed Boards and Printed Board Assemblies - Design and Use - Part 1-1: Generic Requirements - Flatness Considerations for Electronic Assemblies-First Edition |
|
IEC 61190-1-2 |
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly-Edition 2.0 |
|
IEC 61240 |
Preparation of Outline Drawings of Surface-Mounted Devices (SMD) for Frequency Control and Selection - General Rules-First Edition |
|
IEC 61249-2-2 |
Materials for printed boards and other interconnecting structures Part 2-2: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-5 |
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad Brominated epoxied cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-3-4 |
Materials for Printed Boards and Other Interconnecting Structures - Part 3-4: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) - Adhesive Coated Flexible Polyimide Film-First Edition |
|
IEC 61337-1 |
Filters using waveguide type dielectric resonators Part 1: Generic specification-First Edition; Supersedes IEC 61337-1-1:1995 and IEC 61337-1-2:1999 |
|
IEC 61523-1 |
Delay and Power Calculation Standards Part 1: Integrated Circuit Delay and Power Calculation Systems-First Edition |
|
IEC 61523-3 |
Delay and Power Calculation Standards - Part 3: Standard Delay Format (SDF) for the electronic design process-First Edition; IEEE 1497 |
|
IEC 61739 |
Integrated Circuits - Procedures for Manufacturing Line Approval and Quality Management-First Edition; IECQ QC 211000 |
|
IEC 61760-1 |
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)-Edition 2 |
|
IEC 61797-1 |
Transformers and Inductors for Use in Telecommunication and Electronic Equipment - Main Dimensions of Coil Formers - Part 1: Coil Formers for Laminated Cores-Edition 1 |
|
IEC 61943 |
Integrated Circuits - Manufacturing Line Approval Application Guideline-First Edition; IECQ QC 211001 |
|
IEC 62025-2 |
High frequency inductive components Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics-First Edition |
|
IEC 62090 |
Product package labels for electronic components using bar code and two-dimensional symbologies-First Edition |
|
IEC 62137 |
Environmental and endurance testing – Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN-First Edition |
|
IEC 62243 |
Artificial intelligence exchange and service tie to all test environments (AI-ESTATE)-First edition |
|
IEC PAS 61076-3-110 |
Connectors for Electronic Equipment - Part 3-110: Detail Specification 8 Way Connectors for Frequencies Up to 600 MHz-Edition 1.0 |
|
IEC TS 61430 |
Secondary Cells and Batteries - Test Methods for Checking the Performance of Devices Designed for Reducing Explosion Hazards - Lead-Acid Starter Batteries-First Edition |
|
IEC 60151-1 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 1: Measurement of Electrode Current-First Edition |
|
IEC 60151-10 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 10: Methods of Measurement of Audio-Frequency Output Power and Distortion-First Edition |
|
IEC 60151-12 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 12: Methods of Measuring Electrode Resistance, Transconductance, Amplification Factor, Conversion Resistance and Conversion Transconductance-First Edition |
|
IEC 60444-5 |
Measurement of Quartz Crystal Unit Parameters - Part 5: Methods for the Determination of Equivalent Electrical Parameters Using Automatic Network Analyzer Techniques and Error Correction-First Edition |
|
IEC 60512-11-11 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-11: Climatic Tests - Test 11k: Low Air Pressure-First Edition |
|
IEC 60512-11-13 |
Connectors for Electronic Equipment - Tests and Measurements - Part 11-13: Climatic Tests - Test 11n: Gas Tightness, Solderless Wrapped Connections-First Edition; This Standard Along with IEC 60512-11-5, 60512-11-6, 60512-11-9, 60512-11-10 and 60512-11-12 Replaces IEC 60512-6 |
|
IEC 60512-15-8 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 15: Mechanical tests on contacts and terminations - Section 8: Test 15h - Contact retention system resistance to tool application-First Edition |
|
IEC 60512-23-4 |
Connectors for Electronic Equipment - Tests and Measurements - Part 23-4: Screening and Filtering Tests - Test 23d: Transmission Line Reflections in the Time Domain-First Edition |
|
IEC 60512-25-3 |
Connectors for Electronic Equipment - Test and Measurements - Part 25-3: Test 25c - Rise Time Degradation-First Edition |
|
IEC 60512-25-6 |
Connectors for electronic equipment Tests and measurements Part 25-6: Test 25f: Eye pattern and jitter-First Edition |
|
IEC 60512-6-2 |
Connectors for Electronic Equipment - Tests and Measurements - Part 6-2: Dynamic Stress Tests - Test 6b: Bump-First Edition; This Standard Along with 60512-6-1 Replaces IEC 60512-4 |
|
IEC 60603-4 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 4: Two-Part Connectors for Printed Boards Having Contacts Spaced at 1.91 mm (0.075 in) Centres and Staggered Terminations at That Same Spacing-First Edition |
|
IEC 60603-7-7 |
Connectors for electronic equipment - Part 7-7: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 600 MHz-Edition 2.0 |
|
IEC 60615 |
Terminology for Microwave Apparatus-Edition 1 |
|
IEC 60642 |
Piezoelectric Ceramic Resonators and Resonator Units for Frequency Control and Selection Chapter I: Standard Values and Conditions Chapter II: Measuring and Test Conditions-Edition 1; Amendment 1: 09/1992 |
|
IEC 60642-2 |
Piezoelectric ceramic resonator units - Part 2: Guide to the use of piezoelectric ceramic resonator units-First Edition |
|
IEC 60647 |
Dimensions for Magnetic Oxide Cores Intended for Use in Power Supplies (EC-Cores)-Edition 1 |
|
IEC 60747-7-5 |
Semiconductor devices Discrete devices Part 7-5: Bipolar transistors for power switching applications-First Edition |
|
IEC 60748-11 |
Semiconductor Devices - Integrated Circuits Part 11: Sectional Specification for Semiconductor Integrated Circuits Excluding Hybrid Circuits-First Edition; Amendment 1: 06/1995; Amendment 2: 04/1999 |
|
IEC 60748-11-1 |
Semiconductor Devices Integrated Circuits Part 11: Section 1: Internal Visual Examination for Semiconductor Integrated Circuits Excluding Hybrid Circuits-First Edition |
|
IEC 60748-20 |
Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits-First Edition; Amendment 1: 9/1995 |
|
IEC 60748-2-1 |
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section One - Blank Detail Specification for Bipolar Monolithic Digital Integrated Circuit Gates (Excluding Uncommitted Logic Arrays)-First Edition |
|
IEC 60748-2-10 |
Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 10: Blank Detail Specification for Integrated Circuit Dynamic Read/Write Memories-First Edition |
|
IEC 60748-22 |
Semiconductor Devices - Integrated Circuits - Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures-Second Edition; IECQ QC 760200 |
|
IEC 60748-2-20 |
Semiconductor Devices - Integrated Circuits - Part 2-20: Digital Integrated Circuits - Family Specification - Low Voltage Integrated Circuits-First Edition |
|
IEC 60748-22-1 |
Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures-Second Edition |
|
IEC 60748-2-3 |
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Three - Blank Detail Specification for HCMOS Digital Integrated Circuits (Series 54/74 HC, 54/74 HCT, 54/74 HCU)-Edition 1; IECQ QC 790130 |
|
IEC 60748-23-2 |
Semiconductor Devices - Integrated Circuits - Part 23-2: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Internal Visual Inspection and Special Tests-First Edition; IECQ QC 165000-2 |
|
IEC 60748-2-4 |
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Four - Family Specification for Complementary MOS Digital Integrated Circuits, Series 4 000 B and 4 000 UB-Edition 1; IECQ QC 790104 |
|
IEC 60748-2-7 |
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Seven - Blank Detail Specification for Integrated Circuit Fusible-Link Programmable Bipolar Read-Only Memories-First Edition; IECQ QC 790105 |
|
IEC 60748-3-1 |
Semiconductor Devices Integrated Circuits Part 3: Analogue Integrated Circuits Section One - Blank Detail Specification for Monolithic Integrated Operational Amplifiers-First Edition; Same as IECQ QC 790202 |
|
IEC 60758 |
Synthetic Quartz Crystal - Specifications and Guide to the Use-Third Edition |
|
IEC 60807-9 |
Rectangular connectors for frequencies below 3 MHz - Part 9: Detail specification for a range of peritelevision connectors-First Edition |
|
IEC 61021-1 |
Laminated Core Packages for Transformers and Inductors Used in Telecommunication and Electronic Equipment Part 1: Dimensions-First Edition |
|
IEC 61076-2-001 |
Connectors for Electronic Equipment - Part 2-001: Circular Connectors - Blank Detail Specification-First Edition; IECQ QC 480101 |
|
IEC 61076-4-102 |
Connectors with Assessed Quality for Use in d.c., Low-Frequency Analogue and in Digital High Speed Data Applications - Part 4: Printed Board Connectors - Section 102: Detail Specification for Two-Part Single-Pole Connectors, for Multiple Uses on Plug-In Units, with Pre-Centring, Coding and Early Mating Features, Having a Metric Grid in Accordance with IEC 60917-First Edition; IECQ QC 480301XX0003 |
|
IEC 61076-4-105 |
Connectors with Assessed Quality, for Use in D.C., Low-Frequency Analogue and in Digital High Speed Data Applications - Part 4: Printed Board Connectors - Section 105: Detail Specification for 9 mm Circular Connector with 3 to 8 Contacts for Use in a Wide Range of Applications Including the Telecommunication and Audio Industry-Edition 1 |
|
IEC 61076-4-111 |
Connectors for Electronic Equipment - Part 4-111: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Power Connector Modules, for Printed Boards and Backplanes Having Early Mating Features, and Having a Basic Grid of 2,5 mm in Accordance with IEC 60917-1-First Edition; QC 480301XX0012 |
|
IEC 61076-5 |
Connectors for Use in D.C., Low Frequency Analogue and Digital High-Speed Data Applications - Part 5: In-Line Sockets with Assessed Quality - Sectional Specification-First Edition; IECQ QC 480400 |
|
IEC 61189-1 |
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology-Edition 1.1; Edition 1:1997 Consolidated with Amendment 1:2001 |
|
IEC 61189-3 |
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)-Edition 1.1*Consolidated Reprint |
|
IEC 61192-4 |
Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies-First Edition |
|
IEC 61249-2-21 |
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced Base Materials, Clad and Unclad - Non-halogenated Epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-26 |
Materials for printed boards and other interconnecting structures Part 2-26: Reinforced base materials clad and unclad Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-4 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-4: Reinforced Base Materials, Clad and Unclad - Polyester Non-Woven/Woven Fibreglass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-7 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-8 |
Materials for printed boards and other interconnecting structures Part 2-8: Reinforced base materials clad and unclad Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-7-1 |
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper-First Edition |
|
IEC 61337-2 |
Filters using waveguide type dielectric resonators Part 2: Guidance for use-First Edition |
|
IEC 61587-1 |
Mechanical structures for electronic equipment – Tests for IEC 60917 and IEC 60297 – Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis-Edition 2 |
|
IEC 61596 |
Magnetic Oxide EP-Cores and Associated Parts for Use in Inductors and Transformers - Dimensions-First Edition |
|
IEC 61691-2 |
Behavioural Languages - Part 2: VHDL Multilogic System for Model Interoperability-First Edition |
|
IEC 61691-3-2 |
Behavioural languages - Part 3-2: Mathematical operation in VHDL-First Edition |
|
IEC 61691-3-3 |
Behavioural Languages - Part 3-3: Synthesis in VHDL-First Edition |
|
IEC 61747-1 |
Liquid Crystal and Solid-State Display Devices - Part 1: Generic Specification-Edition 1.1; Edition 1:1998 Consolidated with Amendment 1: 2003; QC 720000 |
|
IEC 61747-4-1 |
Liquid crystal display devices Part 4-1: Matrix colour LCD modules Essential ratings and characteristics-First Edition |
|
IEC 62024-1 |
High Frequency Inductive Componenets - Electrical Characteristics and Measuring Methods - Part 1: Nanohenry Range Chip Inductor-First Edition |
|
IEC 62025-1 |
High frequency inductive components – Non-electrical characteristics and measuring methods – Part 1: Fixed, surface mounted inductors for use in electronic and telecommunication equipment-Edition 2 |
|
IEC PAS 62435 |
Electronic components Long-duration storage of electronic components Guidance for implementation-Edition 1 |
|
IEC TR 61604 |
Dimensions of Uncoated Ring Cores of Magnetic Oxides-First Edition |
|
IEC TR 61908 |
The technology roadmap for industry data dictionary structure, utilization and implementation-First Edition |
|
IEC TR 62017-1 |
Documentation on Design Automation Subjects - Part 1: EDA Industry Standards Roadmap-First Edition |
|
IEC TR 62017-2 |
Documentation on Design Automation Subjects - Part 2: EIAJ-EDA Technology Roadmap Toward 2002-First Edition |
|
IEC 60122-2 |
Quartz Crystal Units for Frequency Control and Selection Part 2: Guide to the Use of Quartz Crystal Units for Frequency Control and Selection-Second Edition |
|
IEC 60135 |
Numbering of Electrodes and Designation of Units in Electronic Tubes and Valves-Edition 1 |
|
IEC 60139 |
Preparation of Outline Drawings for Cathode-Ray Tubes, Their Components, Connections and Gauges-Second Edition |
|
IEC 60151-0 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 0: Precautions Relating to Methods of Measurement of Electronic Tubes and Valves-First Edition |
|
IEC 60151-13 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 13: Methods of Measurement of Emission Current from Hot Cathodes for High-Vacuum Electronic Tubes and Valves First Edition-First Edition |
|
IEC 60151-15 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 15: Methods of Measurement of Spurious and Unwanted Electrode Currents-First Edition |
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IEC 60151-16 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 16: Methods of Measurement for Television Picture Tubes-First Edition |
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IEC 60151-17 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 17: Methods of Measurement of Gasfilled Tubes and Valves-Second Edition |
|
IEC 60151-18 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 18: Methods of Measurement of Noises Due to Mechanical or Acoustic Excitations-First Edition |
|
IEC 60151-19 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 19: Methods of Measurement on Corona Stabilizers-First Edition |
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IEC 60151-2 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 2: Measurement of Heater or Filament Current-First Edition |
|
IEC 60151-22 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 22: Methods of Measurement for Cold Cathode Counting and Indicator Tubes-First Edition |
|
IEC 60151-23 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 23: Methods of Measurement of Vacuum Pulse Modulator Tubes and Valves-First Edition |
|
IEC 60151-24 |
Measurements of the Electrical Properties of Electronic Tubes Part 24: Methods of Measurement of Cathode-Ray Charge-Storage Tubes-First Edition |
|
IEC 60151-25 |
Measurements of the Electrical Properties of Electronic Tubes Part 25: Methods of Measurement of Geiger-Muller Counter Tubes-First Edition |
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IEC 60151-26 |
Measurements of the Electrical Properties of Electronic Tubes Part 26: Methods of Measurement for Camera Tubes-First Edition |
|
IEC 60151-4 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 4: Methods of Measuring Noise Factor-First Edition |
|
IEC 60151-5 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 5: Methods of Measuring Hiss and Hum-First Edition |
|
IEC 60151-6 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 6: Methods of Application of Mechanical Shock (Impulse) Excitation to Electronic Tubes and Valves-First Edition |
|
IEC 60151-7 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 7: Measurement of Equivalent Noise Resistance-First Edition |
|
IEC 60191-3 |
Mechanical Standardization of Semiconductor Devices - Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits-Second Edition |
|
IEC 60191-4 |
Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages-Edition 2.2: Edition 1: 1999 Consolidated with Amendments 1: 2001 and 2: 2002 |
|
IEC 60191-6 |
Mechanical Standardization of Semiconductor Devices - Part 6: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages-Second Edition |
|
IEC 60205 |
Calculation of the effective parameters of magnetic piece parts-Edition 3 |
|
IEC 60235-1 |
Measurement of the Electrical Properties of Microwave Tubes Part 1: Terminology-Second Edition |
|
IEC 60352-7 |
Solderless connections Part 7: Spring clamp connections General requirements, test methods and practical guidance-First Edition |
|
IEC 60424-1 |
Ferrite Cores - Guide on the Limits of Surface Irregularities - Part 1: General Specification-First Edition |
|
IEC 60424-2 |
Guidance on the Limits of Surface Irregularities of Ferrite Cores - Part 2: RM-Cores-First Edition |
|
IEC 60424-3 |
Ferrite Cores - Guide on the Limits of Surface Irregularities - Part 3: ETD-Cores and E-Cores-First Edition |
|
IEC 60441 |
Photometric and colorimetric methods of measurement of the light emitted by a cathode-ray tube screen-Edition 1.0 |
|
IEC 60444-2 |
Measurement of Quartz Crystal Unit Parameters by Zero Phase Technique in a PI-Network Part 2: Phase Offset Method for Measurement of Motional Capacitance of Quartz Crystal Units-First Edition |
|
IEC 60444-6 |
Measurement of quartz crystal unit parameters - Part 6: Measurement of drive level dependence (DLD)-First Edition |
|
IEC 60556 |
Gyromagnetic materials intended for application at microwave frequencies – Measuring methods for properties-Edition 2 |
|
IEC 60603-12 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 12: Detail Specification for Dimensions, General Requirements and Tests for a Range of Sockets Designed for Use with Integrated Circuits-First Edition |
|
IEC 60603-13 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 13: Detail Specification for Two-Part Connectors of Assessed Quality, for Printed Boards for Basic Grid of 2,54 mm (0,1 in), with Free Connectors for Non-Accessible Insulation Displacement Terminations (ID)-First Edition; (Same As IECQ QC 010000XX0001) |
|
IEC 60603-14 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 14: Detail Specification for Circular Connectors for Low-Frequency Audio and Video Applications Such as Audio, Video and Audio-Visual Equipment-First Edition |
|
IEC 60620 |
Dimensions for the Mounting of Single-Hole, Bush-Mounted, Spindle-Operated Electronic Components-Edition 2 |
|
IEC 60679-1 |
Quartz crystal controlled oscillators of assessed quality – Part 1: Generic specification-Edition 3.0 |
|
IEC 60679-2 |
Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators-First Edition |
|
IEC 60679-3 |
Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections-Second Edition |
|
IEC 60679-4 |
Quartz Crystal Controlled Oscillators of Assessed Quality - Part 4: Sectional Specification - Capability Approval-First Edition; QC 690100 |
|
IEC 60679-5 |
Quartz Crystal Controlled Oscillators of Assessed Quality - Part 5: Sectional Specification - Qualification Approval-First Edition |
|
IEC 60732 |
Measuring Methods for Cylinder Cores, Tube Cores and Screw Cores of Magnetic Oxides First Edition |
|
IEC 60807-7 |
Rectangular connectors for frequencies below 3 MHz - Part 7: Detail specification for a range of connectors with polarized guides or jackscrews and size 16 (13 A) round contacts - Removable crimp contact types with closed crimp barrels, rear insertion/front release, with assessed quality-First Edition; Same as IECQ QC 030000 XX0002 |
|
IEC 61020-6-2 |
Electromechanical Switches for Use in Electronic Equipment - Part 6: Sectional Specification for Sensitive Switches - Section 2: Detail Specification for One Pole, Unsealed Subminiature Sensitive Switches, 250 V Maximum Electrical Rating-First Edition; IECQ QC 960301XX0001 |
|
IEC 61076-1 |
Connectors for electronic equipment – Product requirements – Part 1: Generic specification-Edition 2 |
|
IEC 61076-2 |
Connectors for Use in d.c., Low-Frequency Analogue and Digital High Speed Data Applications - Part 2: Circular Connectors with Assessed Quality - Sectional Specification-First Edition; IECQ QC 480100 |
|
IEC 61076-2-103 |
Connectors for electronic equipment Part 2-103: Circular connectors Detail specification for a range of multipole connectors (type ´XLR´)-First Edition |
|
IEC 61076-3 |
Connectors for Use in d.c., Low-Frequency Analogue and Digital High-Speed Data Applications - Part 3: Rectangular Connectors with Assessed Quality - Sectional Specification-First Edition |
|
IEC 61076-3-100 |
Connectors for Use in d.c., Low-Frequency Analogue and Digital High-Speed Data Applications - Part 3-100: Rectangular Connectors with Assessed Quality - Detail Specification for a Range of Shielded Connectors with Trapezoidal-Shaped Shells and Non-Removable Ribbon Contacts on a 1,27 mm Double Row-First Edition; IECQ QC 480201XX0001 |
|
IEC 61076-4 |
Connectors with Assessed Quality, for Use in D.C., Low-Frequency Analogue and in Digital High-Speed Data Applications - Part 4: Sectional Specification - Printed Board Connectors-Edition 1 |
|
IEC 61076-4-100 |
Connectors for Electronic Equipment - Part 4-100: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Connector Modules Having a Grid of 2,5 mm for Printed Boards and Backplanes-Second Edition; IECQ QC 480301/XX 0001 |
|
IEC 61076-6 |
Connectors for electronic equipment Part 6: Loose part contacts Sectional specification-First Edition |
|
IEC 61076-7 |
Connectors for Use in D.C., Low-Frequency Analogue and Digital High-Speed Data Applications - Part 7: Cable Outlet Accessories with Assessed Quality, Including Qualification and Capability Approval - Sectional Specification-First Edition; IECQ QC 480600 |
|
IEC 61076-7-001 |
Connectors for electronic equipment Part 7-001: Cable outlet accessories Blank detail specification-First Edition |
|
IEC 61190-1-3 |
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications-Edition 2.0 |
|
IEC 61191-3 |
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies-First Edition |
|
IEC 61192-1 |
Workmanship requirements for soldered electronic assemblies Part 1: General-First Edition |
|
IEC 61249-2-10 |
Materials for printed boards and other interconnecting structures Part 2-10: Reinforced base materials clad and unclad Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-11 |
Materials for printed boards and other interconnecting structures Part 2-11: Reinforced base materials clad and unclad - polyimide, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-13 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-13: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Cyanate Ester Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-23 |
Materials for printed boards and other interconnecting structures Part 2-23: Reinforced base materials, clad and unclad Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-3-5 |
Materials for Printed Boards and Other Interconnecting Structures - Part 3-5: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) - Transfer Adhesive Films-First Edition |
|
IEC 61249-8-7 |
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks-First Edition |
|
IEC 61249-8-8 |
Materials for Interconnection Structures - Part 8: Sectional Specification Set for Non-Conductive Films and Coatings - Section 8: Temporary Polymer Coatings-First Edition |
|
IEC 61332 |
Soft Ferrite Material Classification-Edition 2 |
|
IEC 61631 |
Test Method for the Mechanical Strength of Cores Made of Magnetic Oxides-First Edition |
|
IEC 61837-1 |
Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 1: Plastic Moulded Enclosure Outlines-First Edition; Shall Be Read in Conjunction with IEC 61240 |
|
IEC 61837-2 |
Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 2: Ceramic Enclosures-First Edition |
|
IEC 61837-3 |
Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 3: Metal Enclosures-First Edition |
|
IEC 61837-4 |
Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Part 4: Hybrid enclosure outlines-First Edition |
|
IEC 61964 |
Integrated Circuits - Memory Devices Pin Configurations-First Edition |
|
IEC 61967-1 |
Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions-First Edition |
|
IEC 61967-5 |
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 5: Measurement of conducted emissions Workbench Faraday Cage method-First Edition |
|
IEC 61988-2-2 |
Plasma display panels Part 2-2: Measuring methods Optoelectrical-First Edition |
|
IEC 62132-5 |
Integrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 5: Workbench Faraday cage method-Edition 1 |
|
IEC 62258-2 |
Semiconductor die products Part 2: Exchange data formats-Edition 1 |
|
IEC 62265 |
Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells and blocks-First Edition |
|
IEC 62317-4 |
Ferrite cores Dimensions Part 4: RM-cores and associated parts-Edition 1; Supersedes IEC 60431 |
|
IEC 62358 |
Ferrite cores Standard inductance factor (AL) and its tolerance-First Edition |
|
IEC PAS 62169 |
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices-Edition 1.0 |
|
IEC TR 61967-4-1 |
Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4-First Edition |
|
IEC TS 61994-1 |
Piezoelectric and dielectric devices for frequency control and selection Glossary Part 1: Piezoelectric and dielectric resonators-First Edition |
|
IEC TS 61994-3 |
Piezoelectric and dielectric devices for frequency control and selection Glossary Part 3: Piezoelectric and dielectric oscillators-First Edition |
|
IEC 60122-3 |
Quartz Crystal Units of Assessed Quality - Part 3: Standard Outlines and Lead Connections-Third Edition |
|
IEC 60151-14 |
Measurements of the Electrical Properties of Electronic Tubes Part 14: Methods of Measurement of Radar and Oscilloscope Cathode-Ray Tubes-Second Edition |
|
IEC 60151-20 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 20: Methods of Measurement of Thyratron Pulse Modulators-First Edition |
|
IEC 60151-21 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 21: Methods of Measurement of Cross-Modulation in Electronic Tubes and Valves-First Edition |
|
IEC 60151-27 |
Measurements of the Electrical Properties of Electronic Tubes Part 27: Methods of Measurement for Intermodulation Products in Transmitting Tubes-First Edition |
|
IEC 60151-28 |
Measurements of the Electrical Properties of Electronic Tubes Part 28: Methods of Measurement of Colour Television Picture Tubes-First Edition |
|
IEC 60151-3 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 3: Measurement of Equivalent Input and Output Admittances-First Edition |
|
IEC 60151-8 |
Measurements of the Electrical Properties of Electronic Tubes and Valves Part 8: Measurement of Cathode Heating Time and Heater Warm-Up Time-First Edition; Corrigendum-07/1967 |
|
IEC 60191-5 |
Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)-Second Edition |
|
IEC 60191-6-12 |
Mechanical Standardization of Semiconductor Devices - Part 6-12: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Land Grid Array (FLGA) - Rectangular Type-First Edition |
|
IEC 60352-6 |
Solderless Connections - Part 6: Insulation Piercing Connections - General Requirements, Test Methods and Practical Guidance-First Edition |
|
IEC 60401-2 |
Terms and nomenclature for cores made of magnetically soft ferrites Part 2: Reference of dimensions-First Edition |
|
IEC 60444-1 |
Measurement of Quartz Crystal Unit Parameters by Zero Phase Technique in a Pi-Network - Part 1: Basic Method for the Measurement of Resonance Frequency and Resonance Resistance of Quartz Crystal Units by Zero Phase Technique in a Pi-Network-Second Edition; Amendment 1: 08-1999 |
|
IEC 60444-7 |
Measurement of quartz crystal unit parameters . Part 7: Measurement of activity and frequency dips of quartz crystal units-First Edition |
|
IEC 60548 |
Expression of the Properties of Sampling Oscilloscopes-Edition 1 |
|
IEC 60562 |
Measurements of Incidental Ionizing Radiation from Electronic Tubes-Edition 1 |
|
IEC 60603-10 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 10: Two-Part Connectors for Printed Boards for Basic Grid of 2,54 mm (0,1 in), Inverted Type-First Edition |
|
IEC 60603-11 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 11: Detail Specification for Concentric Connectors (Dimensions for Free Connectors and Fixed Connectors)-First Edition |
|
IEC 60603-6 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 6: Edge-Socket Connectors and Printed-Board Connectors with 2.54 mm (0.1 in) Contact Spacing for Single or Double-Sided Printed Boards of 1.6 mm (0.063 in) Nominal Thickness-First Edition |
|
IEC 60603-8 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 8: Two-Part Connectors for Printed Boards for Basic Grid of 2,54 mm (0,1 in), with Square Male Contacts of 0,63 mm x 0,63 mm First Edition |
|
IEC 60603-9 |
Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 9: Two-Part Connectors for Printed Boards, Backpanels and Cable Connectors, Basic Grid of 2,54 mm (0,1 in)-First Edition |
|
IEC 60679-4-1 |
Quartz Crystal Controlled Oscillators of Assessed Quality - Part 4-1: Blank Detail Specification - Capability Approval-First Edition; QC 690101 |
|
IEC 60679-5-1 |
Quartz Crystal Controlled Oscillators of Assessed Quality - Part 5-1: Blank Detail Specification - Qualification Approval-First Edition; QC 690201 |
|
IEC 60796-2 |
Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS 1) Part 2: Mechanical and pin descriptions for the system bus configuration, with edge connectors (direct)-First Edition |
|
IEC 60807-3 |
Rectangular connectors for frequencies below 3 MHz. Part 3: Detail specification for a range of connectors with trapezoidal shaped metal shells and round contacts - Removable crimp contact types with closed crimp barrels, rear insertion/rear extraction-First Edition |
|
IEC 60807-6 |
Rectangular connectors for frequencies below 3 MHz. Part 6: Detail specification for a range of rectangular connectors with size 20 (7.5 A) round contacts having polarized guides - Fixed solder contact types-First Edition |
|
IEC 61019-1 |
Surface acoustic wave (SAW) resonators Part 1: Generic specification-First Edition; Supersedes IEC 61019-1-1:1990 and IEC 61019-1-2:1993 |
|
IEC 61019-2 |
Surface Acoustic Wave (SAW) Resonators - Part 2: Guide to the Use-Edition 2 |
|
IEC 61019-3 |
Surface acoustic wave (SAW) resonators Part 3: Standard outlines and lead connections-First edition |
|
IEC 61076-3-001 |
Connectors for Use in d.c., Low-Frequency Analogue and Digital High-Speed Data Applications - Part 3-001: Rectangular Connectors with Assessed Quality - Blank Detail Specification-First Edition |
|
IEC 61076-3-101 |
Connectors with Assessed Quality, for Use in d.c., Low-Frequency Analogue and in Digital High-Speed Data Applications - Part 3: Rectangular Connectors - Section 101: Detail Specification for a Range of Shielded Connectors with Trapezoidal Shaped Shells and Non-Removable Rectangular Contacts on a 1,27 mm x 2,54 mm Centre-Line-First Edition; IECQ QC 480201XX0002 |
|
IEC 61076-4-001 |
Connectors with Assessed Quality, for Use in D.C., Low-Frequency Analogue and in Digital High-Speed Data Applications - Part 4: Printed Board Connectors - Section 001: Blank Detail Specification-Edition 1 |
|
IEC 61076-4-104 |
Connectors for Use in d.c. Low-Frequency Analogue and Digital High Speed Data Applications - Part 4-104: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Connectors, Basic Grid of 2,0 mm, with Terminations on a Multiple Grid of 0,5 mm-First Edition; IECQ QC 480301XX0005 |
|
IEC 61076-4-107 |
Connectors for Electronic Equipment - Part 4-107: Printed Board Connectors with Assessed Quality - Detail Specification for Shielded Two-Part Connectors Having a Basic Grid of 2,0 mm, Fixed Part with Solder and Press-In Terminations for Printed Boards, Free Part with Non-Accessible Insulation Displacement and Crimp Terminations-First Edition; QC 480301XX0008 |
|
IEC 61076-4-113 |
Connectors for electronic equipment Printed board connectors Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications-First Edition |
|
IEC 61076-4-114 |
Connectors for electronic equipment Part 4-114: Printed board connectors Detail specification for two-part connector with integrated shielding function having a grid of 1 mm 1,5 mm-First Edition |
|
IEC 61080 |
Guide to the Measurement of Equivalent Electrical Parameters of Quartz Crystal Units-First Edition |
|
IEC 61193-1 |
Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies-First Edition |
|
IEC 61249-2-12 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-12: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Epoxide Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-18 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-18: Reinforced Base Materials, Clad and Unclad - Polyester Non-Woven Fibreglass Reinforced Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-19 |
Materials for Printed Boards and Other Interconnecting Structures - Part 2-19: Reinforced Base Materials, Clad and Unclad - Exoxide Cross-Plied Linear Fibreglass-Reinforced Laminated Sheets of Defined Flammability (Vertical Burning Test), Copper-Clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-22 |
Materials for printed boards and other interconnecting structures Part 2-22: Reinforced base materials clad and unclad Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-6 |
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad Brominated epoxied nonwoven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-2-9 |
Materials for printed boards and other interconnecting structures Part 2-9: Reinforced base materials clad and unclad Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad-First Edition; Replaces IEC 60249 Series |
|
IEC 61249-3-3 |
Materials for Printed Boards and Other Interconnecting Structures - Part 3-3: Sectional Specification Set for Unreinforced Base Materials, Clad and Unclad (Intended for Flexible Printed Boards) - Adhesive Coated Flexible Polyester Film-First Edition |
|
IEC 61249-5-1 |
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)-First Edition |
|
IEC 61249-5-4 |
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks-First Edition |
|
IEC 61747-2-1 |
Liquid Crystal and Solid-State Display Devices - Part 2-1: Passive Matrix Monochrome LCD Modules - Blank Detail Specification-First Edition; QC 720301 |
|
IEC 61747-5 |
Liquid Crystal and Solid-State Display Devices - Part 5: Environmental, Endurance and Mechanical Test Methods-Edition 1 |
|
IEC 61747-6 |
Liquid crystal and solid-state display devices Part 6: Measuring methods for liquid crystal modules Transmissive type-First Edition |
|
IEC 61830 |
Microwave Ferrite Components - Measuring Methods for Major Properties-First Edition |
|
IEC 61860 |
Dimensions of Low-Profile Cores Made of Magnetic Oxides-First Edition |
|
IEC 61967-2 |
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method-First Edition |
|
IEC 61967-6 |
Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz - Part 6: Measurement of Conducted Emissions - Magnetic Probe Method-First Edition |
|
IEC 61988-2-1 |
Plasma display panels Part 2-1: Measuring methods Optical-First Edition |
|
IEC 62050 |
VHDL Register Transfer Level (RTL) synthesis-First Edition; IEEE 1076.6 |
|
IEC 62142 |
Verilog register transfer level synthesis-Edition 1; IEEE 1364.1 |
|
IEC 62317-7 |
Ferrite cores Dimensions Part 7: EER-cores-Edition 1 |
|
IEC 62323 |
Dimensions of half pot-cores made of ferrite for inductive proximity switches-Edition 1 |
|
IEC PAS 62162 |
Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components-Edition 1.0 |
|
IEC TR 60283 |
Methods for the Measurement of Frequency and Equivalent Resistance of Unwanted Resonances of Filter Crystal Units-Edition 1.0 |
|
IEC TR 62258-3 |
Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage-Edition 1 |
|
IEC TS 61944 |
Integrated Circuits - Manufacturing Line Approval - Demonstration Vehicles-First Edition |
|
IEC TS 61945 |
Integrated Circuits - Manufacturing Line Approval - Methodology for Technology and Failure Analysis-First Edition |
|
IEC TS 61967-3 |
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 3: Measurement of radiated emissions Surface scan method-Edition 1 |
|
IEC TS 61994-2 |
Piezoelectric and Dielectric Devices for Frequency Control and Selection - Glossary - Part 2: Piezoelectric and Dielectric Filters-First Edition |
|
IEC TS 61994-4-1 |
Piezoelectric and Dielectric Devices for Frequency Control and Selection - Glossary Part 4-1: Piezoelectric Materials - Synthetic Quartz Crystal-First Edition |
|
IEC TS 61994-4-2 |
Piezoelectric and dielectric devices for frequency control and selection Glossary Part 4-2: Piezoelectric and dielectric materials Piezoelectric ceramics-First Edition |
|
IEC TS 61994-4-4 |
Piezoelectric and dielectric devices for frequency control and selection Glossary Part 4-4: Materials Materials for Surface Acoustic Wave (SAW) devices-Edition 1.0 |