ECA EIA-800 Integrated Passive Device (IPD) Chipscale Package Design Guidelines

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ECA EIA-800 Document Information:

Title
Integrated Passive Device (IPD) Chipscale Package Design Guidelines

Electronic Components Association

Publication Date:
Mar 1, 1999

Scope:

Introduction

This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier–customer unique.

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