SEMI E1.9 MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 mm WAFERS

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SEMI E1.9 Document Information:

Title
MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 mm WAFERS

Semiconductor Equipment and Materials International

Publication Date:
Nov 1, 2006

Scope:

This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Most of the requirements given in this specification are in the form of maximum or minimum dimensions wit very few required surfaces. Only the mechanical interfaces for cassettes are specified; no materials requirements or micro-contamination limits are given. However, this standard has been written so that both metal and injection-molded plastic cassettes can be manufactured in conformance with it.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This standard specifies the cassettes used to transport and store 300 mm wafers in an IC manufacturing facility. This includes both manual and auto-transport use as well as high-speed extraction of the wafers in processing equipment.

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