SEMI G69 TEST METHOD FOR MEASUREMENT OF ADHESIVE STRENGTH BETWEEN LEADFRAMES AND MOLDING COMPOUNDS

	Purchase Information Use this form to request purchase information on SEMI online subscriptions. SEMI Collections First Name: Last Name: Email address:

Document SEMI G69 is offered by IHS as part of an online subscription. This subscription contains many documents on the same topic.

You may also purchase this document alone from the IHS Standards Store.

SEMI G69 Document Information:

Title
TEST METHOD FOR MEASUREMENT OF ADHESIVE STRENGTH BETWEEN LEADFRAMES AND MOLDING COMPOUNDS

Semiconductor Equipment and Materials International

Publication Date:
Sep 1, 1996

Scope:

This document may be used on all types of semiconductor leadframe and molding compound.

The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a guideline.

The methods in this document use SI units.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This document describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages.

The procedures include shear test, pull test, and three-point bending techniques.

About IHS
IHS (NYSE: IHS) is a leading global provider of critical technical information, decision-support tools and related services in a number of industries including aerospace and defense, automotive, construction, electronics, and energy. IHS serves customers ranging from large governments and multinational corporations to smaller companies and technical professionals in more than 100 countries. IHS been in business for more than 45 years and employ more than 2,300 people around the world.