IPC 6012B AMD 2 Qualification and Performance Specification for Rigid Printed Boards
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IPC 6012B AMD 2 Document Information:
Title
Qualification and Performance Specification for Rigid Printed Boards
IPC-Association Connecting Electronics Industries
Publication Date:
Apr 1, 2008
Scope:
Statement of Scope This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided, double-sided, with or without plated-through holes. The printed board may be multilayer with plated-through holes and with or without buried/blind vias. The printed board may be multilayer containing build up HDI layers conforming to IPC-6016. The printed board may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. The printed board may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.6.
Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards.
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