 |
| Purchase Information |
| Use this form to request purchase information on SEMI online subscriptions. |
|
 |
Document SEMI MS2 is offered by IHS as part of an online subscription. This subscription contains many documents on the same topic.
You may also purchase this document alone from the IHS Standards Store.
SEMI MS2 Document Information:
Title
TEST METHOD FOR STEP HEIGHT MEASUREMENTS OF THIN FILMS
Semiconductor Equipment and Materials International
Publication Date:
Nov 1, 2009
Scope:
This test method presents a procedure for measuring step heights
of thin films using step height test structures. It applies only to
films, such as those found in microelectromechanical system (MEMS)
materials, which can be accurately imaged using an optical
interferometer or comparable instrument with the capability of
obtaining topographical 2-D data traces.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
This test method enables the determination of step height
measurements of thin films. Step height measurements can be used to
determine thin film thickness values. Thickness
measurements1 are an aid in the design and fabrication
of MEMS devices and can be used to obtain thin film material
parameters, such as Young's modulus.2
1 Marshall, J. C., and Vernier, P. T., "Electro-Physical
Technique for Post-Fabrication Measurements of CMOS Process Layer
Thicknesses," NIST J. Res., Vol. 112, No. 5 (2007): pp.
223–256.
Gupta, R. K., Osterberg, P. M., and Senturia, S. D., "Material
Property Measurements of Micromechanical Polysilicon Beams,"
Microlithography and Metrology in Micromachining II, SPIE,
Vol 2880 (October 14-15, 1996): pp. 39–45.
Jensen, B. D., de Boer, M. P., Masters, N. D., Bitsie, F., and
LaVan, D. A., "Interferometry of Actuated Microcantilevers to
Determine Material Properties and Test Structure Nonidealities in
MEMS," Journal of Microelectromechanical Systems, Vol 10
(September 2001): pp. 336–346.
Marshall, J. C., "New Optomechanical Technique for Measuring
Layer Thickness in MEMS Processes," Journal of
Microelectromechanical Systems, Vol 10 (March 2001): pp.
153–157.
2 Marshall, J. C., Herman, D. L., Vernier, P. T., DeVoe, D. L.
and Gaitan, M., "Young's Modulus Measurements in Standard IC CMOS
Processes using MEMS Test Structures," IEEE Electron
Device Letters, Vol. 28, No. 11 (2007): pp. 960–963.
About IHS
IHS (NYSE: IHS) is a leading global provider of critical technical information, decision-support tools and related services in a number of industries including aerospace and defense, automotive, construction, electronics, and energy. IHS serves customers ranging from large governments and multinational corporations to smaller companies and technical professionals in more than 100 countries. IHS been in business for more than 45 years and employ more than 2,300 people around the world.