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SEMI MF671 Document Information:
Title
TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS
Semiconductor Equipment and Materials International
Publication Date:
Jul 1, 2007
Scope:
This test method covers techniques for determination of the
length of the flatted portion of a wafer periphery.
This test method is intended primarily for use on electronic
materials in the form of nominally circular edge-contoured wafers
with flat lengths up to 65 mm. The precision of this test method
has been established directly only for silicon wafers, but it is
not expected to be material dependent.
This test method is suitable for referee measurement purposes
and may be used for routine acceptance measurements when specified
limits require test precision greater than can be obtained with
hand held scale and unaided eye.
This test method is independent of surface finish.
For application to wafers of diameter 3 in. or smaller, the
values stated in inch-pound units are to be regarded as the
standard whether or not they appear in parentheses; the values
stated in acceptable metric units are for information only. For
application to wafers of diameter larger than 3 in., the values
stated in acceptable metric units are to be regarded as the
standard; the values stated in inch-pound units are for information
only.
NOTE 1: DIN 50441, Part 4, is a similar, but not equivalent
method for determining flat length. In this method the flat length
is calculated from a measurement of flat depth. This method does
not provide any correction for rounding at the ends of the
flat.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
The length of fiducial flats is an important materials
characteristic for determining the suitability of material for use
in semiconductor processing.
Automatic wafer handling equipment widely used in semiconductor
device manufacturing processes relies on identification and
orientation of the primary flat to obtain correct alignment.
This test method is suitable for use in research, development,
process control, quality assurance, and materials acceptance
applications.
Keywords:
- flat
- optical comparator
- primary flat
- secondary flat
- semiconductor
- silicon
- wafer
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