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Document SEMI M31 is offered by IHS as part of an online subscription. This subscription contains many documents on the same topic.
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SEMI M31 Document Information:
Title
MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS
Semiconductor Equipment and Materials International
Publication Date:
Jul 1, 2008
Scope:
This standard is intended to set an appropriate level of
specification that places minimal limits on innovation while
ensuring modularity and interchangeability at all mechanical
interfaces. However, this standard has been written so that
injection-molded plastic FOSBs can be manufactured in conformance
with it, and those can be utilized for maintaining wafers quality
during transportation, opening and closing the door.
This standard assumes that the FOSB is used in the last process
in wafer manufacturing, in acceptance and inspection, and in
transferring the wafers from the FOSB to a FOUP, FOBIT or open
cassette inside an IC manufacturing facility. The FOSB is not
intended to be used in IC manufacturing processes. It is
recommended that wafers be transferred from the FOSB to a FOUP,
FOBIT or open cassette using automated methods. As described in ¶
5.4, the purchaser needs to specify which type of FOSB door is
required:
Manual door as described in ¶ 5.4.1; or
Automated–shippable door as described in ¶ 5.4.2.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
This standard specifies the front-opening shipping box (FOSB)
used to ship 300 mm wafers from wafer suppliers to their customers
(typically IC manufacturers), while maintaining wafer quality.
NOTE 1: Refer to SEMI silicon wafer related specifications
M-series such as SEMI M1 as for a wafer quality.
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