SEMI G65 TEST METHOD FOR EVALUATION OF LEADFRAME MATERIALS USED FOR L-LEADED (GULL WING TYPE) PACKAGES

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SEMI G65 Document Information:

Title
TEST METHOD FOR EVALUATION OF LEADFRAME MATERIALS USED FOR L-LEADED (GULL WING TYPE) PACKAGES

Semiconductor Equipment and Materials International

Publication Date:
Jan 1, 1996

Scope:

This test method may be applied to leadframes for L-leaded packages such as QFP, SOP, TSOP, etc

This test method may also be applied to any leadframe materials with thickness = 0.15 mm.

The test method may be used in trim and form tool suppliers, leadframe material suppliers, leadframe manufacturers, and package engineers.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This test method describes an evaluation method for bending characteristics of leadframe materials used for L-leaded packages.

NOTE 1: The lead fatigue test described in MIL-STD-883/2004 is not suitable for evaluating the bending characteristics of fine pitch leadframes or leadframes used for L-leaded packages because the method is based on reforming the leads

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