SEMI G73 TEST METHOD FOR PULL STRENGTH FOR WIRE BONDING

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SEMI G73 Document Information:

Title
TEST METHOD FOR PULL STRENGTH FOR WIRE BONDING

Semiconductor Equipment and Materials International

Publication Date:
Sep 1, 1997

Scope:

This standard defines the destructive pull strength test method and its criterion for evaluating pull strength of wire bonds connecting two points, connected by using ball bonding technique.

This standard can be applied to measure wires whose diameter is less than 100 microns.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This standard defines the pull strength test method for wire bonding.

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