IPC TM-650 2.6.7.2 Thermal Shock, Continuity and Microsection, Printed Board
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IPC TM-650 2.6.7.2 Document Information:
Title
Thermal Shock, Continuity and Microsection, Printed Board
IPC-Association Connecting Electronics Industries
Publication Date:
May 1, 2004
Scope:
This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause physical fatigue.
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