SEMI E70 GUIDE FOR TOOL ACCOMMODATION PROCESS

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SEMI E70 Document Information:

Title
GUIDE FOR TOOL ACCOMMODATION PROCESS

Semiconductor Equipment and Materials International

Publication Date:
Nov 1, 2003

Scope:

This overview document will provide process development, facilities, manufacturing, and sales engineers (as well as purchasing agents and managers) with a basic understanding of the various elements in a Tool Accommodation methodology. This process emphasizes quality, completeness, timeliness, and costeffectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities. By describing a generic process flow, this document identifies a road map for using published standards that comprehend all the procedures involved in tool accommodation from procurement through acceptance. As a common ground for communication and comparison, terms and definitions are also included.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This document will provide an overview of the various elements of Tool Accommodation, a methodology by which semiconductor processing equipment is installed in a cost-effective and timely manner. This addition to the SEMI Tool Accommodation Standards set describes the process by which the referenced SEMI documents can be effectively used to achieve tool installation cost and schedule goals.

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