SEMI G14 GUIDELINE FOR SPECIFYING THE DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC MOLDED DIP PACKAGE TOOLING

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SEMI G14 Document Information:

Title
GUIDELINE FOR SPECIFYING THE DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC MOLDED DIP PACKAGE TOOLING

Semiconductor Equipment and Materials International

Publication Date:
Jan 1, 1988

Scope:

Preface

This document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line tool makers as the basis for defining the limits of manufacturing tolerances.

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