SEMI G66 TEST METHOD FOR THE MEASUREMENT OF WATER ABSORPTION CHARACTERISTICS FOR SEMICONDUCTOR PLASTIC MOLDING COMPOUNDS

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SEMI G66 Document Information:

Title
TEST METHOD FOR THE MEASUREMENT OF WATER ABSORPTION CHARACTERISTICS FOR SEMICONDUCTOR PLASTIC MOLDING COMPOUNDS

Semiconductor Equipment and Materials International

Publication Date:
Jan 1, 1996

Scope:

This method may be applied to all semiconductor plastic molding compounds.

This method may be used to characterize molding compounds in development.

Packaging engineers may simulate the water absorption characteristics and their significance in relation to package cracks at soldering by using calculated diffusion and solubility coefficients.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This method describes a procedure for measuring the water absorption rate for plastic molding compounds and provides a method to calculate the diffusion and solubility coefficients, which are required to simulate the water absorption characteristics.

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