IPC J-STD-004B Requirements for Soldering Fluxes
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IPC J-STD-004B Document Information:
Title
Requirements for Soldering Fluxes
IPC-Association Connecting Electronics Industries
Publication Date:
Dec 1, 2008
Scope:
This standard prescribes general requirements for the
classification and characterization of fluxes for high quality
solder interconnections. This standard may be used for quality
control and procurement purposes.
Purpose
The purpose of this standard is to classify and characterize
tin/lead and lead-free soldering flux materials for use in
electronic metallurgical interconnections for printed circuit board
assembly. Soldering flux materials include the following: liquid
flux, paste flux, solder paste, solder cream, and flux-coated and
flux-cored solder wires and preforms. It is not the intent of this
standard to exclude any acceptable flux or soldering material;
however, these materials must produce the desired electrical and
metallurgical interconnection. The requirements for fluxes are
defined in general terms for standard classification. Appendix B
has additional information that will help users understand some of
the requirements of this standard. In practice, where more
stringent requirements are necessary or other manufacturing
processes are used, the user shall define these as additional
requirements.
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