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IPC 4562A Document Information:
Title
Metal Foil for Printed Board Applications
IPC-Association Connecting Electronics Industries
Publication Date:
Apr 1, 2008
Scope:
This specification covers metal foils supported by carrier films
and unsupported foils suitable for subsequent use in printed
boards. Unless otherwise agreed upon between user and supplier
(AABUS), metal foils shall be considered
acceptable, so long as the requirements in this specification are
met.
Purpose
This specification addresses the requirements for procurement of
metal foils used only in printed wiring applications.
Specification Sheet Description
At the end of this document is a series of specification sheets.
Each sheet outlines engineering and performance data for a metal
foil. The sheets are provided with a number for ordering purposes.
For example, if a user wishes to order from specification sheet 1,
the number "1" would be substituted for the "X" in the above
designation example (e.g., IPC-4562/1).
The metal foils contained in this standard represent known
materials. As new foils become available, they will be added to
future revisions. Users and material developers are encouraged to
supply information on new materials for review by the Metallic
Foils Task Group (3-12a). Users who wish to invoke this
specification for metal foils not listed shall
list a 0 (zero) for the specification sheet number (e.g.,
IPC-4562/0).
This specification provides quality classes (see 1.2.3 through
1.2.7) for requirements to reflect functional performance (see
Appendix A) and testing properties. The reference of a single class
does not preclude invoking specific requirements defined in other
classes.
Foil Metal
The metal foil shall be designated by a
suitable two- or three-letter code:
CU - Copper
NI - Nickel
XX - Other
Foil Type
Metal foil types shall be distinguished by
their process of manufacture and shall be
designated as:
E - Electrodeposited
W - Wrought (rolled)
O - Other
Foil Grade
Foil Grades
Foil grades shall be distinguished according to
the following foil grade designations:
1. Standard electrodeposited (STD-Type E)
2. High ductility electrodeposited (HD-Type E)
3. High temperature elongation electrodeposited (HTE-Type E)
5. As rolled-wrought (AR-Type W)
7. Annealed-wrought (ANN-Type W)
8. As rolled-wrought low temperature annealable (LTA-Type W)
9. Nickel, standard electrodeposited
10. Electrodeposited low temperature annealable (LTA-Type E)
11. Electrodeposited annealable (A-Type E)
Other Metal Foil Grades
Other metal foil grades will be designated as the need
arises.
Foil Weight and Thickness
Copper Foil Area Weight
The area weight and nominal thickness for copper
shall be as identified in Table 1-1.
Thickness of Foils Other than Copper
Thickness of all other metals shall be
indicated by dimensions to the nearest 0.025 mm [0.0009843 in].
Bond Enhancement Treatment
The bond enhancement treatment used on the metal foil
shall be designated as one of the following:
N - No treatment; no stain proofing
P - No treatment; stain proofing both sides
S - Single-sided bond enhancement treatment (matte side); stain
proofing on both sides
Foil Profile
All foils shall have a two-letter descriptor to
designate the profile of both the cathode and anode/matte sides.
Order shall be the cathode side followed by matte
side. Profile ranges not accommodated below will be AABUS.
Quality/Performance Classification
Three general classes have been established to reflect
progressive increases in inspection and testing frequency. It
should also be recognized that there is typically an overlap
between classes. In many cases the difference between classes is
one of attribute assurance level not attribute difference. The user
has the responsibility to determine the class into which his
product belongs. Testing and inspection requirements in this
specification have been separated so the metallic foil may be
tested to any one of the three quality/performance classes.
The three classes are:
Class 1 Material in this class is suitable for
applications where mechanical properties and cosmetic defects are
not important, and the only requirement is functionality of the
complete circuit. This material has no prescribed inspection and
testing requirements.
Class 2 Material in this class is suitable for
use where circuit design, process yield, and specification
conformance requirements allow localized areas of nonconformance.
This material has moderate levels of assurance, demonstrated via
the use of testing and/or statistical process control
(SPC)/statistical quality control (SQC) techniques.
Class 3 Material in this class is suitable for
applications where high levels of assurance are required. These
levels of assurance shall be demonstrated via the
use of testing and/or SPC/SQC techniques.
Presentation
All dimensions and tolerances are expressed in millimeters and
are not direct conversions in order to provide usable numbers.
Users are cautioned to employ a single system and not mix metric
and English equivalents. Reference information is shown in brackets
[ ].
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