IPC TM-650 2.6.8 Thermal Stress, Plated-Through Holes
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IPC TM-650 2.6.8 Document Information:
Title
Thermal Stress, Plated-Through Holes
IPC-Association Connecting Electronics Industries
Publication Date:
May 1, 2004
Scope:
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process.
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