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SEMI MF1982 Document Information:
Title
TEST METHODS FOR ANALYZING ORGANIC CONTAMINANTS ON SILICON WAFER SURFACES BY THERMAL DESORPTION GAS CHROMATOGRAPHY
Semiconductor Equipment and Materials International
Publication Date:
Nov 1, 2003
Scope:
These test methods cover the identification and quantification
of organic contaminants on silicon wafer surfaces using a gas
chromatograph interfaced to a mass spectrometer (GC-MS) or a
phosphorus selective detector, or both.
These test methods describe the apparatus and related procedures
for sample preparation and analyses by thermal desorption gas
chromatography (TD-GC).1,2
The range of detection limits of these test methods depends on
the target organic compounds, for example, the range of detection
limits is from the subpicogram to the nanogram level of
hydrocarbons (C8 to C28) per square
centimeter of silicon wafer surface.
These test methods can be used for polished silicon wafers, or
silicon wafers with oxide films.
Two methods are described. Method A is performed on cleaved
wafers. Method B is performed on full wafers. The detailed
procedures of Method A and Method B as well as the differences
between them, are described in Sections 5 and 7.
Suitable safety precautions must be followed when handling
organic solvents and compounds, hot materials subjected to propane
flame, the propane flame itself, wafer thermal desorption systems,
rapid thermal annealer, or a high temperature furnace.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the user of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
1 Fergason, L.A., "Analysis of Organic
Impurities on Silicon Wafer Surfaces," Microcontamination,
4(4), 33-37, April 1986.
2 Saga, K. and Hattori, T., "Identification and
Removal of Trace Organic Contamination on Silicon Wafers Stored in
Plastic Boxes," Journal of Electrochemical Society, 143,
3270-3284 (1996).
Keywords:
- atomic emission detector (AED)
- flame ionization detector (FID)
- flame photometric detector (FPD)
- gas chromatography
- mass spectrometer (MS)
- nitrogen/phosphorus thermionic ionization detector (NPD)
- organic contamination
- organophosphorus compounds
- phosphorus selective detector
- silicon wafer surfaces
- thermal desorption
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