SEMI G25 TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS

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SEMI G25 Document Information:

Title
TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS

Semiconductor Equipment and Materials International

Publication Date:
Jan 1, 1989

Scope:

Purpose

This document defines the equipment, materials, and procedure used to measure the resistance of leads in packaging elements. This document uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described herein; however, this measurement technique can be applied to other geometrics with proper consideration.

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