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SEMI E63 MECHANICAL SPECIFICATION FOR 300 mm BOX OPENER/LOADER TO TOOL STANDARD (BOLTS-M) INTERFACE


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SEMI E63 Document Information:

Title
MECHANICAL SPECIFICATION FOR 300 mm BOX OPENER/LOADER TO TOOL STANDARD (BOLTS-M) INTERFACE

Semiconductor Equipment and Materials International

Publication Date:
Nov 1, 2004

Scope:

This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interface is specified; no materials requirements or micro-contamination limits are given. The interface specified in this standard is designed for a tool with a sealed minienvironment, but it could also just be a well-defined automation interface. This interface is not intended to provide high repeatability or rapid removal (both of which can be provided by other couplings in the box opener/loader unit). This specification also does not apply when load ports are stacked one on top of the other. This specification does not apply when inserting open cassettes into load-lock chambers directly.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This standard specifies the tool side of the mechanical interface between the main part of a process or metrology tool and the component that opens boxes and presents the boxes to the tool wafer handler for unloading and loading 300 mm wafers. The box opener/loader unit would include one or more load ports (that would conform to SEMI E15.1) as well as storage capacity for empty boxes or waiting lots (if needed by the tool throughput). The box opener/loader unit might not only be configured to handle boxes (that would conform to SEMI E47.1 and SEMI E62) but also to open cassettes (that would conform to SEMI E1.9). This standard defines one interface for all such carriers and for any carrier capacity (13 and 25 wafers).

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