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SEMI MF523 Document Information:
Title
PRACTICE FOR UNAIDED VISUAL INSPECTION OF POLISHED SILICON WAFER SURFACES
Semiconductor Equipment and Materials International
Publication Date:
Nov 1, 2007
Scope:
This practice covers an inspection procedure for determining the
surface quality of silicon wafers that have been polished on one
side.
This practice is intended as a large-volume acceptance method
and does not require use of a microscope or other optical
instruments. The inspection relies heavily on the visual acuity of
the operator; therefore, test results may be very
operator-sensitive.
NOTE 1: For clarification of the identification of certain
observed defects, illustrations are given in SEMI MF154.
Defects visible to the unaided eye on polished wafer surfaces
are categorized in three groups by the illumination geometry that
best delineates them: front-surface high-intensity light,
front-surface diffuse light and back-surface diffuse light. These
defects originate from two sources: (1) imperfections in the
silicon crystal, and (2) damage from the manufacturing process,
including handling and packaging.
The inspection described generally takes place after polishing
and post-polish cleaning but before packaging. Although cleaning
and packaging procedures are not a part of this practice, the
inspection may be performed on a packaged product to determine the
effect of such procedures on the quality of the polished
wafers.
The values stated in SI units are to be regarded as the
standard. The values given in parentheses are for information
only.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Keywords:
- collimated light
- defects
- high-intensity light
- particle
- polished
- silicon
- visual inspection
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