SEMI G16 SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC CHIP CARRIER TOOLING

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SEMI G16 Document Information:

Title
SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC CHIP CARRIER TOOLING

Semiconductor Equipment and Materials International

Publication Date:
Jan 1, 1988

Scope:

Preface

This document is a guideline for the ordering of tooling required to mold and form plastic chip carriers. It is to be used by packaging engineers, mold manufacturers and end of line tool makers as the basis for defining the limits of manufacturing tolerances.

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