SEMI G46 TEST METHOD FOR THERMAL TRANSIENT TESTING FOR DIE ATTACHMENT EVALUATION OF INTEGRATED CIRCUITS
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SEMI G46 Document Information:
Title
TEST METHOD FOR THERMAL TRANSIENT TESTING FOR DIE ATTACHMENT EVALUATION OF INTEGRATED CIRCUITS
Semiconductor Equipment and Materials International
Publication Date:
Jan 1, 1988
Scope:
Purpose
— Evaluation of semiconductor die attachment integrity using the
thermal transient techniques as implemented by the Electrical Test
Method on either thermal test chips or active devices.
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