SEMI G63 TEST METHOD FOR MEASUREMENT OF DIE SHEAR STRENGTH
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SEMI G63 Document Information:
Title
TEST METHOD FOR MEASUREMENT OF DIE SHEAR STRENGTH
Semiconductor Equipment and Materials International
Publication Date:
Jan 1, 1995
Scope:
This test method shall be used for the measurement of the die
shear strength when die attach paste is used to bond a die to a
leadframe bond pad.
This test method shall be used for quality control and
development at die attach paste suppliers and for incoming
inspection and selection of the die attach paste at die attach
paste users.
This test method can be applicable to die attach material
besides paste material and may be used to evaluate leadframe bond
pad quality.
This standard does not purport to address safety issues, if any,
associated with its use. It is the responsibility of the users of
this standard to establish appropriate safety health practices and
determine the applicability or regulatory limitations prior to
use.
Purpose
The purpose of this test method is to determine procedures for
die shear strength testing.
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