EIA EIA-763 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
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EIA EIA-763 Document Information:
Title
Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
Electronic Industries Alliance
Publication Date:
Jun 1, 2002
Scope:
This standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. Refer to EIA 48 1-1 for current industry standard for 8 mm and 12 mm taping of surface mount components.
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