SEMI E137 GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

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SEMI E137 Document Information:

Title
GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

Semiconductor Equipment and Materials International

Publication Date:
Jul 1, 2005

Scope:

This standard has been developed as a guide for final assembly and packaging at the supplier's facility through relocation of SME, separate subassemblies, and components from the customer's loading dock/receiving area to their cleanroom manufacturing area for both high and ultrahigh purity applications.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

The objective of this document is to establish standard guidelines for activities specific to the final assembly and packaging at the supplier's facility, transportation, and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer's cleanroom manufacturing area.

NOTE 1: As with any SEMI guide, the practices outlined herein are recommendations, not specifications. Users of this document should recognize that alternate practices are not excluded as long as they produce results that are equivalent to those produced using the recommendations outlined here and meet the requirements of the end user.

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