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SEMI M35 Document Information:
Title
GUIDE FOR DEVELOPING SPECIFICATIONS FOR SILICON WAFER SURFACE FEATURES DETECTED BY AUTOMATED INSPECTION
Semiconductor Equipment and Materials International
Publication Date:
Nov 1, 2007
Scope:
This guide addresses specifications related to localized light
scatterers (LLSs) as well as extended light scatterers (XLSs).
Examples of LLSs are particles and pits. Examples of XLSs are
scratches and regions of high roughness (surface haze).
Illustrative examples of many of the features discussed in this
guide may be found in SEMI MF154.
Surface scanners, which have discriminated between XLSs and LLSs
for several years, are now discriminating (and selectively
reporting) between different types of LLSs (e.g., pits and
particles).
Specific numbers limiting feature levels and/or densities are to
be agreed upon between suppliers and customers. This guide provides
a framework for that communication that result in specifications
flexible enough to accommodate variations in measurement due to
different SSIS models.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
Inspection of silicon wafer surfaces is a standard outgoing test
on all commercially sold silicon wafers.
Older specifications referred to visual inspection of wafer
surfaces, but with advanced technologies, the sizes of many
important surface features are too small to be seen visually and so
other types of surface inspection become necessary.
This guide provides a specification framework for reporting
measurements of silicon wafer surface features through the use of
scanning (or automated) surface inspection systems (SSIS).
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