ECA 216 Adhesion of Printed Wiring, Method of Test for

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ECA 216 Document Information:

Title
Adhesion of Printed Wiring, Method of Test for

Electronic Components Association

Publication Date:
Jan 1, 1959

Scope:

This Standard is intended for determining the following characteristics of printed wiring boards: (a) resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of conductors at standard room temperature before and after solder dipping, and at elevated temperatures, and (c) resistance of large conductor areas to blistering as a result of solder dipping.

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