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SEMI E119 Document Information:
Title
MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONTOPENING BOX FOR INTERFACTORY TRANSPORT OF 300 mm WAFERS
Semiconductor Equipment and Materials International
Publication Date:
Jul 1, 2006
Scope:
This standard is intended to set an appropriate level of
specification that places minimal limits on innovation while
ensuring modularity and inter-changeability at all mechanical
interfaces. Only the physical interfaces for FOBIT are specified;
no materials requirements or micro-contamination limits are given.
However, this standard has been written so that both metal and
injection-molded plastic FOBITs can be manufactured in conformance
with it.
This standard assumes that the FOBIT is intended for use in the
interfactory transportation of wafers. The following boundary
conditions were used in the creation of this specification:
• Minimizing the pitch between wafers will reduce the cost of
transporting wafers.
• The FOBIT will be used for interfactory transportation of both
processed and unprocessed wafers.
• The box will have a 25 wafer capacity.
• Random access of wafers, using edge grip handling devices, is
not a requirement for this standard
• The FOBIT will be compatible with the following 300 mm
Standards:
• 13-wafer FIMS Interface (SEMI E62)
• 300 mm Load Port (SEMI E15.1)
• Kinematic Coupling (SEMI E57)
• The FOBIT will not necessarily be compliant with the following
300 mm Standards due to wafer restraint requirements and product
applications during transportation:
• 300 mm Front-Opening Unified Pod (SEMI E47.1)
• 300 mm Open Cassette (SEMI E1.9)
• 300 mm Front-Opening Shipping Box (SEMI M31)
• The technical requirements of this standard are written for
the transportation of nominal thickness wafers, as defined by SEMI
M1.15.
This reduced-pitch, 25 capacity FOBIT is designed for use with
the 13 capacity FIMS interface, as specified in SEMI E62.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
This standard partially specifies a reduced-pitch front-opening
box for interfactory transport of 300 mm wafers (FOBIT). This
reduced-pitch box, with a capacity of 25 wafers but with the
approximate physical volume of a 13 wafer FOUP, is intended to
reduce the cost of transporting wafers between IC manufacturing
sites. To leverage current industry 300 mm technology, this
reduced-pitch front-opening box is intended to interface with 13
wafer FIMS, as specified in SEMI E62.
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