SEMI G19 SPECIFICATION FOR DIP LEADFRAMES PRODUCED BY ETCHING

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SEMI G19 Document Information:

Title
SPECIFICATION FOR DIP LEADFRAMES PRODUCED BY ETCHING

Semiconductor Equipment and Materials International

Publication Date:
Sep 1, 1997

Scope:

Preface

This specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers and has been developed to meet the requirements of automatic bonders.

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