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SEMI MF1451 Document Information:
Title
TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
Semiconductor Equipment and Materials International
Publication Date:
Jul 1, 2007
Scope:
This test method covers a non-contacting, nondestructive
procedure to determine the sori of clean, dry semiconductor
wafers.
This test method employs a two-probe system that examines both
external surfaces of the wafer simultaneously.
The test method is applicable to wafers 50 mm or larger in
diameter, and approximately 100 µm and larger in thickness,
independent of thickness variation and surface finish, and of
gravitationally induced wafer distortion.
This test method is not intended to measure the flatness of
either exposed silicon surface. Sori is a measure of the distortion
of the front surface of the wafer.
NOTE 1: The front surface may contain regions with upward or
downward curvature or both; under some conditions the front surface
may be flat.
This test method measures sori of a wafer corrected for
mechanical forces applied during the test. Therefore, the procedure
described gives the unconstrained value of sori.
NOTE 2: This sori is indicated by the acronym "GFLYFER" in
Appendix 2, Shape Decision Tree, of SEMI M1.
This test method includes several methods for canceling
gravity-induced deflection which could otherwise alter the shape of
the wafer.1
NOTE 3: One of these methods, the Representative Wafer Inversion
Method, is covered by a patent held by ADE Corporation, 80 Wilson
Way, Westwood, MA 02090-1806.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
1 Poduje, N., "Eliminating Gravitational Effect in Wafer Shape
Measurements," NIST/ASTM/SEMI/SEMATECH Technology Conference,
Dallas, TX. Technology for Advanced Materials/Process
Characterization, February 1, 1990.
Keywords:
- non-contact measurement
- semiconductor
- shape
- silicon
- sori
- wafers
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