SEMI G9 SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
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SEMI G9 Document Information:
Title
SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
Semiconductor Equipment and Materials International
Publication Date:
Jan 1, 1989
Scope:
Preface
This specification is a guideline for the stamping manufacture
of leadframes for plastic molded dual-inline semiconductor
packages. It is a design guideline for packaging engineers,
leadframe stampers and mold manufacturers, and has been developed
to meet the requirements of automatic bonding.
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