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SEMI F28 Document Information:
Title
TEST METHOD FOR MEASURING PARTICLE GENERATION FROM PROCESS PANELS
Semiconductor Equipment and Materials International
Publication Date:
Nov 1, 2003
Scope:
This test method addresses total particle counts greater than
the minimum detection limit (MDL) of the particle counter and does
not consider classifying data into various size ranges.
This procedure utilizes a particle counter applied to process
panels typically used in semiconductor applications. It applies to
process gas supply systems (e.g., gas cabinets) which include a
process panel, an inert purge panel, and a system vent. Both
automatic and manual process panels are within the scope of this
test procedure. Panels, as defined in this test method, are
considered to consist of 6.35 mm O. D. × 0.89 mm wall (1/4" O.D. ×
0.035" wall) tubing and components.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
The purpose of this document is to define a method for testing
process panels intended for installation in high-purity gas
distribution systems. Application of this test method is expected
to yield comparable data among process panels tested for the
purposes of qualification for this installation.
This document describes a test method designed to draw
comparisons of particulate generation performance of process
panels. This test method evaluates the cleanliness of process
panels in the “as received” condition as well as under normal
operating conditions. The “as received” test is intended to enable
the user to evaluate the fabrication, cleaning, and packaging
techniques of the manufacturer of the process panel. The test under
actual operating conditions is intended to allow the user to
evaluate the manufacturer’s component selection as well as the
quality of the panel design. The specific flow rates described in
both test methods are representative of relatively high flow
conditions for a typical process panel.
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