ECA EIA/ECA-961 QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS
 |
| Purchase Information |
| Use this form to request purchase information on ECA online subscriptions. |
|
|
Document ECA EIA/ECA-961 is offered by IHS as part of an online subscription. This subscription contains many documents on the same topic.
You may also purchase this document alone from the IHS Standards Store.
ECA EIA/ECA-961 Document Information:
Title
QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS
Electronic Components, Assemblies & Materials Association
Publication Date:
Nov 1, 2005
About IHS
IHS (NYSE: IHS) is a leading global provider of critical technical information, decision-support tools and related services in a number of industries including aerospace and defense, automotive, construction, electronics, and energy. IHS serves customers ranging from large governments and multinational corporations to smaller companies and technical professionals in more than 100 countries. IHS been in business for more than 45 years and employ more than 2,300 people around the world.
