SEMI G68 TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES
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SEMI G68 Document Information:
Title
TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES
Semiconductor Equipment and Materials International
Publication Date:
Sep 1, 1996
Scope:
The results of this test method are used to obtain the junction
temperature.
The measurement results are usually different from the results
obtained by testing in the fluid bath environment described in SEMI
G30 and SEMI G43.
This test method uses SI units.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
The purpose of this test is to determine the thermal resistance
of semiconductor packages using thermal test chips. This test
method deals with junction-to-case measurements of thermal
resistance in air environment.
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