IPC 2223B Sectional Design Standard for Flexible Printed Boards
 |
| Purchase Information |
| Use this form to request purchase information on IPC online subscriptions. |
|
|
Document IPC 2223B is offered by IHS as part of an online subscription. This subscription contains many documents on the same topic.
You may also purchase this document alone from the IHS Standards Store.
IPC 2223B Document Information:
Title
Sectional Design Standard for Flexible Printed Boards
IPC-Association Connecting Electronics Industries
Publication Date:
May 1, 2008
Scope:
This standard establishes the specific requirements for the
design of flexible printed circuit applications and its forms of
component mounting and interconnecting structures. The flexible
materials used in the structures are comprised of insulating films,
reinforced and/or non-reinforced, dielectric in combination with
metallic materials. These interconnecting boards may contain
single, double, multilayer, or multiple conductive layers and can
be comprised wholly of flex or a combination of both flex and
rigid.
Purpose The requirements contained herein are
intended to establish specific design details that
shall be used in conjunction with IPC-2221 and may
also be used in conjunction with IPC-2222 for the rigid sections of
rigidflex circuits.
About IHS
IHS (NYSE: IHS) is a leading global provider of critical technical information, decision-support tools and related services in a number of industries including aerospace and defense, automotive, construction, electronics, and energy. IHS serves customers ranging from large governments and multinational corporations to smaller companies and technical professionals in more than 100 countries. IHS been in business for more than 45 years and employ more than 2,300 people around the world.
