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IEC 60269-4 Low-voltage fuses – Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices


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IEC 60269-4 Document Information:

Title
Low-voltage fuses – Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

Fusibles basse tension – Partie 4: Exigences supplémentaires concernant les éléments de remplacement utilisés pour la protection des dispositifs à semiconducteurs

International Electrotechnical Commission

Publication Date:
Nov 1, 2006

Scope:

Scope and object

These supplementary requirements apply to fuse-links for application in equipment containing semiconductor devices for circuits of nominal voltages up to 1 000 V a.c. or 1 500 V d.c. and also, in so far as they are applicable, for circuits of higher nominal voltages.

NOTE 1 Such fuse-Iinks are commonly referred to as “semiconductor fuse-links”.

NOTE 2 In most cases, a part of the associated equipment serves the purpose of a fuse-base. Owing to the great variety of equipment, no general rules can be given; the suitability of the associated equipment to serve as a fuse-base should be subject to agreement between the manufacturer and the user. However, if separate fuse-bases or fuse-holders are used, they should comply with the appropriate requirements of IEC 60269-1.

The object of these supplementary requirements is to establish the characteristics of semiconductor fuse-links in such a way that they can be replaced by other fuse-links having the same characteristics, provided that their dimensions are identical. For this purpose, this standard refers in particular to

a) The following characteristics of fuses:

1) their rated values;

2) their temperature rises in normal service;

3) their power dissipation;

4) their time-current characteristics;

5) their breaking capacity;

6) their cut-off current characteristics and their I2t characteristics;

7) their arc voltage limits.

b) Type tests for verification of the characteristics of fuses.

c) The markings on fuses.

d) Availability and presentation of technical data (see Annex B).

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