SEMI MS1 GUIDE TO SPECIFYING WAFER-WAFER BONDING ALIGNMENT TARGETS

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SEMI MS1 Document Information:

Title
GUIDE TO SPECIFYING WAFER-WAFER BONDING ALIGNMENT TARGETS

Semiconductor Equipment and Materials International

Publication Date:
Mar 1, 2007

Scope:

This guide applies to targets that can be used with two common alignment processes – inner surface alignment and outer surface alignment.

This guide covers specification requirements, mark characteristics and applications.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

Purpose

This guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.

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