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SEMI P23 Document Information:
Title
GUIDELINES FOR PROGRAMMED DEFECT MASKS AND BENCHMARK PROCEDURES FOR SENSITIVITY ANALYSIS OF MASK DEFECT INSPECTION SYSTEMS
Semiconductor Equipment and Materials International
Publication Date:
Feb 1, 2000
Scope:
This guideline defines the content and methods for use of test
masks used in the evaluation of mask defect inspection systems.
Although it is possible to use this test mask to evaluate
transcription of defects etc., this standard does not attempt to
define these processes.
This guideline shall be revised when a new effective measurement
technology for defect sizing becomes commonly available in the
market.
NOTICE: This standard does not purport to
address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
Purpose
The purpose of this guideline is to propose a test mask to be
used for evaluation of the sensitivity of Mask Defect Inspection
Systems. This test mask consists of test chips including programmed
pattern defects and reference test chips without programmed
defects. Since the test chip is an assembly of cells, the test
chips are defined in this guideline by cell patterns, programmed
defects in cell patterns, and the layout of the cells. Also, the
test mask is defined by defining the test chips arrangement.
Furthermore, the use of this mask is described. It is desirable
that these test masks and benchmark procedures be used when the
sensitivity of a Mask Defect Inspection System is evaluated.
Background — Different masks have been used by many
equipment manufacturers and users in the past, and sensitivity has
been tested by various methods decided independently by each
manufacturer and user. In some cases, no common measurement methods
or sensitivity analysis methods have been agreed upon. Therefore,
confusion exists concerning the sensitivity comparison of equipment
between manufacturers, the definition for specifications between
users and suppliers, and the definition for specifications between
users. Also, due to the fact that several problems were found when
using the previous guideline in actual manufacturing, the document
has been reviewed and content has been changed throughout. It was
also the goal of this revision, while considering ease of
manufacturing of test masks first, to fully cover the evaluation of
mask defect inspection systems.
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