ASTM Int'l Electronics Standard - ASTM WK9490 - Will Impact Tantalum Industry
December 18, 2006 // Published as a news service by IHS
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According to ASTM International, a standard being developed by ASTM Committee F01 on Electronics will prove to be useful to the tantalum sputtering target industry.
The proposed standard, ASTM WK9490 - Test Method for Reporting Crystallographic Orientation of Sputtering Target Materials - is under the jurisdiction of ASTM Subcommittee F01.17 on Sputter Metallization.
"The tantalum sputtering target industry has struggled for years to find a method to characterize the structural uniformity of tantalum plate," said Kurt Moser, product development manager, H.C. Starck Inc.
"Until the development of electron beam backscatter diffraction, determining crystallographic orientation was laborious and difficult to quantify.
"With EBSD, this has improved dramatically to the point where we have developed a method to quantify the through-thickness crystallographic orientation uniformity."
Moser said that the proposed method can be used for research and development efforts, product quality evaluation and possibly for specifications.
In addition to being able to test tantalum, ASTM believes ASTM WK9490 can be used with other materials, notably niobium and molybdenum. Users of other materials, such as aluminum and copper, are encouraged to comment on the potential usefulness of ASTM WK9490 on the materials with which they work. Moser says the committee believes that ASTM WK9490 will work with most materials that develop through-thickness texture changes.
Source: ASTM International.