NTT Docomo, Renesas, Fujitsu, Sharp to Jointly Develop Platform for HSUPA Mobile Phone
October 27, 2008 // Published as a news service by IHS
NTT Docomo Inc., Renesas Technology Corp., Fujitsu Ltd. and Sharp Corp. will jointly develop the SH-Mobile G4 single-chip large scale integration (LSI) device, and a platform incorporating it, to support the high-speed uplink packet access (HSUPA)/high-speed downlink packet access (HSDPA)/wideband code division multiple access (WCDMA) and global system for mobile communications/general packet radio service/enhanced data rates for GSM evolution (GSM/GPRS/EDGE) (2G) mobile telephony standards.
Development of the platform is targeted for completion by 4Q of fiscal 2009.
The new SH-Mobile G4 will be fabricated with 45 nanometer process technology to enable highly integrated functions and extra-fast processing, the companies said.
It will provide enhanced functionality and improved performance for applications handling high-definition (HD) video and 3D graphics.
In addition to HSDPA cat. 8 for extra-fast downlink speeds (max. 7.2 Mbps), the SH-Mobile G4 will support HSUPA to boost uplink speeds to a maximum of 5.7 Mbps, almost 15 times faster than the conventional 384 kbps speeds. This, the companies said, will enable faster bidirectional data transfers.
Renesas said it plans to provide the platform to the worldwide mobile phone market, in addition to customers in Japan.
Source: Fujitsu.